Inventor

JACOBSON JOHN O

US60 patents

Patents

50 patents

US6462423B1Oct 8, 2002

Interconnect for making temporary electrical connections with bumped semiconductor components

MICRON TECHNOLOGY INC158 citations99

US5915977AJun 29, 1999

System and interconnect for making temporary electrical connections with bumped semiconductor components

MICRON TECHNOLOGY INC164 citations99

US5893726AApr 13, 1999

Semiconductor package with pre-fabricated cover and method of fabrication

MICRON TECHNOLOGY INC174 citations99

US5593927AJan 14, 1997

Method for packaging semiconductor dice

MICRON TECHNOLOGY INC342 citations99

US6208157B1Mar 27, 2001

Method for testing semiconductor components

MICRON TECHNOLOGY INC120 citations98

US6072326AJun 6, 2000

System for testing semiconductor components

MICRON TECHNOLOGY INC102 citations98

US6057597AMay 2, 2000

Semiconductor package with pre-fabricated cover

MICRON TECHNOLOGY INC107 citations98

US5894218AApr 13, 1999

Method and apparatus for automatically positioning electronic dice within component packages

MICRON TECHNOLOGY INC137 citations98

US6900459B2May 31, 2005

Apparatus for automatically positioning electronic dice within component packages

MICRON TECHNOLOGY INC28 citations96

US6553276B2Apr 22, 2003

Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

MICRON TECHNOLOGY INC48 citations96

US6420892B1Jul 16, 2002

Calibration target for calibrating semiconductor wafer test systems

MICRON TECHNOLOGY INC62 citations96

US6362637B2Mar 26, 2002

Apparatus for testing semiconductor wafers including base with contact members and terminal contacts

MICRON TECHNOLOGY INC61 citations96

US6363295B1Mar 26, 2002

Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

MICRON TECHNOLOGY INC64 citations96

US6239590B1May 29, 2001

Calibration target for calibrating semiconductor wafer test systems

MICRON TECHNOLOGY INC70 citations96

US6064216AMay 16, 2000

Apparatus for testing semiconductor wafers

MICRON TECHNOLOGY INC50 citations96

US6064194AMay 16, 2000

Method and apparatus for automatically positioning electronic dice within component packages

MICRON TECHNOLOGY INC51 citations96

US5955877ASep 21, 1999

Method and apparatus for automatically positioning electronic dice within component packages

MICRON TECHNOLOGY INC40 citations96

US5907492AMay 25, 1999

Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

MICRON TECHNOLOGY INC81 citations96

US7155300B2Dec 26, 2006

Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

MICRON TECHNOLOGY INC25 citations93

US7120513B1Oct 10, 2006

Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs

MICRON TECHNOLOGY INC26 citations93

US6998334B2Feb 14, 2006

Semiconductor devices with permanent polymer stencil and method for manufacturing the same

MICRON TECHNOLOGY INC19 citations93

US6703714B2Mar 9, 2004

Methods for fabricating flip-chip devices and preventing coupling between signal interconnections

MICRON TECHNOLOGY INC16 citations93

US6627999B2Sep 30, 2003

Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps

MICRON TECHNOLOGY INC17 citations93

US6396291B1May 28, 2002

Method for testing semiconductor components

MICRON TECHNOLOGY INC40 citations93

US6353326B2Mar 5, 2002

Test carrier with molded interconnect for testing semiconductor components

MICRON TECHNOLOGY INC15 citations93

US6296171B1Oct 2, 2001

Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems

MICRON TECHNOLOGY INC22 citations93

US6064221AMay 16, 2000

Method of temporarily securing a die to a burn-in carrier

MICRON TECHNOLOGY INC24 citations93

US6045026AApr 4, 2000

Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems

MICRON TECHNOLOGY INC23 citations93

US5895222AApr 20, 1999

Encapsulant dam standoff for shell-enclosed die assemblies

MICRON TECHNOLOGY INC17 citations93

US5894167AApr 13, 1999

Encapsulant dam standoff for shell-enclosed die assemblies

MICRON TECHNOLOGY INC17 citations93

US5786632AJul 28, 1998

Semiconductor package

MICRON TECHNOLOGY INC32 citations93

US6687989B1Feb 10, 2004

Method for fabricating interconnect having support members for preventing component flexure

MICRON TECHNOLOGY INC15 citations92

US6492187B1Dec 10, 2002

Method for automatically positioning electronic die within component packages

MICRON TECHNOLOGY INC21 citations92

US6407570B1Jun 18, 2002

Interconnect for testing semiconductor components having support members for preventing component flexure

MICRON TECHNOLOGY INC17 citations92

US6369600B2Apr 9, 2002

Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure

MICRON TECHNOLOGY INC23 citations92

US6210984B1Apr 3, 2001

Method and apparatus for automatically positioning electronic dice within component packages

MICRON TECHNOLOGY INC17 citations92

US6150828ANov 21, 2000

Method and apparatus for automatically positioning electronic dice with component packages

MICRON TECHNOLOGY INC16 citations92

US6085962AJul 11, 2000

Wire bond monitoring system for layered packages

MICRON TECHNOLOGY INC29 citations92

US6353312B1Mar 5, 2002

Method for positioning a semiconductor die within a temporary package

MICRON TECHNOLOGY INC9 citations82

US5920513AJul 6, 1999

Partial replacement of partially defective memory devices

MICRON TECHNOLOGY INC14 citations82

US7561938B2Jul 14, 2009

Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs

MICRON TECHNOLOGY INC7 citations74

US6713879B2Mar 30, 2004

Semiconductor substract with substantially matched lines

MICRON TECHNOLOGY INC6 citations74

US6619532B2Sep 16, 2003

Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems

MICRON TECHNOLOGY INC5 citations74

US6551845B1Apr 22, 2003

Method of temporarily securing a die to a burn-in carrier

MICRON TECHNOLOGY INC7 citations74

US6544461B1Apr 8, 2003

Test carrier with molded interconnect for testing semiconductor components

MICRON TECHNOLOGY INC7 citations74

US6538463B2Mar 25, 2003

Semiconductor die and retaining fixture

MICRON TECHNOLOGY INC5 citations74

US6427899B2Aug 6, 2002

Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems

MICRON TECHNOLOGY INC6 citations74

Showing the top 50 of 60 patents by PatentIndex Score.

JACOBSON JOHN O

Patents

Flip-chip with matched lines and ground plane

Wire bond monitoring system for layered packages

Apparatus for testing semiconductor wafers

Interconnect for making temporary electrical connections with bumped semiconductor components

System and interconnect for making temporary electrical connections with bumped semiconductor components

Semiconductor package with pre-fabricated cover and method of fabrication

Method for packaging semiconductor dice

Method for testing semiconductor components

System for testing semiconductor components

Semiconductor package with pre-fabricated cover

Method and apparatus for automatically positioning electronic dice within component packages

Apparatus for automatically positioning electronic dice within component packages

Method of using data regarding manufacturing procedures integrated circuits (IC&#39;s) have undergone, such as repairs, to select procedures the IC&#39;s will undergo, such as additional repairs

Calibration target for calibrating semiconductor wafer test systems

Apparatus for testing semiconductor wafers including base with contact members and terminal contacts

Method for using data regarding manufacturing procedures integrated circuits (IC&#39;s) have undergone, such as repairs, to select procedures the IC&#39;s will undergo, such as additional repairs

Calibration target for calibrating semiconductor wafer test systems

Apparatus for testing semiconductor wafers

Method and apparatus for automatically positioning electronic dice within component packages

Method and apparatus for automatically positioning electronic dice within component packages

Method for using data regarding manufacturing procedures integrated circuits (IC&#39;s) have undergone, such as repairs, to select procedures the IC&#39;s will undergo, such as additional repairs

Method for using data regarding manufacturing procedures integrated circuits (IC&#39;s) have undergone, such as repairs, to select procedures the IC&#39;s will undergo, such as additional repairs

Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs

Semiconductor devices with permanent polymer stencil and method for manufacturing the same

Methods for fabricating flip-chip devices and preventing coupling between signal interconnections

Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps

Method for testing semiconductor components

Test carrier with molded interconnect for testing semiconductor components

Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems

Method of temporarily securing a die to a burn-in carrier

Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems

Encapsulant dam standoff for shell-enclosed die assemblies

Encapsulant dam standoff for shell-enclosed die assemblies

Semiconductor package

Method for fabricating interconnect having support members for preventing component flexure

Method for automatically positioning electronic die within component packages

Interconnect for testing semiconductor components having support members for preventing component flexure

Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure

Method and apparatus for automatically positioning electronic dice within component packages

Method and apparatus for automatically positioning electronic dice with component packages

Wire bond monitoring system for layered packages

Method for positioning a semiconductor die within a temporary package

Partial replacement of partially defective memory devices

Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs

Semiconductor substract with substantially matched lines

Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems

Method of temporarily securing a die to a burn-in carrier

Test carrier with molded interconnect for testing semiconductor components

Semiconductor die and retaining fixture

Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems

Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs

Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs