Inventor
UESHIMA MINORU
JP35 patents
⚠️ This page may combine multiple inventors who share the name “UESHIMA MINORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SENJU METAL INDUSTRY CO
19 patentsUS7682468B2Mar 23, 2010
Lead-free solder alloy
SENJU METAL INDUSTRY CO15 citations92
US7338567B2Mar 4, 2008
Lead-free solder alloy
SENJU METAL INDUSTRY CO19 citations92
US7282175B2Oct 16, 2007
Lead-free solder
SENJU METAL INDUSTRY CO32 citations91
US7029542B2Apr 18, 2006
Lead-free solder alloy
SENJU METAL INDUSTRY CO8 citations73
US9796053B2Oct 24, 2017
High-temperature lead-free solder alloy
SENJU METAL INDUSTRY CO3 citations70
US8343383B2Jan 1, 2013
Anisotropic conductive material
SENJU METAL INDUSTRY CO3 citations63
US10297539B2May 21, 2019
Electronic device including soldered surface-mount component
SENJU METAL INDUSTRY CO1 citations62
US10968932B2Apr 6, 2021
Soldered joint and method for forming soldered joint
SENJU METAL INDUSTRY CO0 citations61
US10272527B2Apr 30, 2019
Solder alloy, and LED module
SENJU METAL INDUSTRY CO1 citations61
US12119131B2Oct 15, 2024
Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part
SENJU METAL INDUSTRY CO0 citations60
US11331759B2May 17, 2022
Solder alloy for power devices and solder joint having a high current density
SENJU METAL INDUSTRY CO0 citations60
US11217359B2Jan 4, 2022
Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part
SENJU METAL INDUSTRY CO0 citations60
US7628308B2Dec 8, 2009
Method of replenishing an oxidation suppressing element in a solder bath
SENJU METAL INDUSTRY CO5 citations55
US7537728B2May 26, 2009
Method for increasing the effectiveness of a component of a material
SENJU METAL INDUSTRY CO0 citations52
US7451805B2Nov 18, 2008
Pouring apparatus for molten metal and casting method
SENJU METAL INDUSTRY CO0 citations52
US10265807B2Apr 23, 2019
Solder alloy and module
SENJU METAL INDUSTRY CO0 citations50
US9487846B2Nov 8, 2016
Electroconductive bonding material
SENJU METAL INDUSTRY CO0 citations50
US10658107B2May 19, 2020
Method of manufacturing permanent magnet
SENJU METAL INDUSTRY CO0 citations49
US11024598B2Jun 1, 2021
Metallic sintered bonding body and die bonding method
SENJU METAL INDUSTRY CO0 citations48
UESHIMA MINORU
7 patentsUS9185812B2Nov 10, 2015
Lead-free solder paste
UESHIMA MINORU2 citations62
US8303735B2Nov 6, 2012
Lead-free low-temperature solder
UESHIMA MINORU3 citations62
US10354944B2Jul 16, 2019
Method for soldering surface-mount component and surface-mount component
UESHIMA MINORU0 citations51
US8790472B2Jul 29, 2014
Process for producing a solder preform having high-melting metal particles dispersed therein
UESHIMA MINORU0 citations51
US8975757B2Mar 10, 2015
Lead-free solder connection structure and solder ball
UESHIMA MINORU1 citations48
US8865062B2Oct 21, 2014
High-temperature lead-free solder alloy
UESHIMA MINORU1 citations48
US9205513B2Dec 8, 2015
Bi—Sn based high-temperature solder alloy
UESHIMA MINORU0 citations45
KAWAMATA YUJI
3 patentsUS8845826B2Sep 30, 2014
Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder
KAWAMATA YUJI11 citations82
US8888932B2Nov 18, 2014
Indium-containing lead-free solder for vehicle-mounted electronic circuits
KAWAMATA YUJI2 citations61
US9227258B2Jan 5, 2016
Lead-free solder alloy having reduced shrinkage cavities
KAWAMATA YUJI1 citations43