P

Inventor

ENGELHARDT MANFRED

AT70 patents
⚠️ This page may combine multiple inventors who share the name “ENGELHARDT MANFRED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

33 patents
US9627287B2Apr 18, 2017

Thinning in package using separation structure as stop

INFINEON TECHNOLOGIES AG153 citations98
US6387773B1May 14, 2002

Method for fabricating trenches having hallows along the trenches side wall for storage capacitors of DRAM semiconductor memories

INFINEON TECHNOLOGIES AG22 citations93
US7321097B2Jan 22, 2008

Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same

INFINEON TECHNOLOGIES AG16 citations84
US6454956B1Sep 24, 2002

Structuring method

INFINEON TECHNOLOGIES AG18 citations84
US6296777B1Oct 2, 2001

Structuring process

INFINEON TECHNOLOGIES AG17 citations84
US6930052B2Aug 16, 2005

Method for producing an integrated circuit having at least one metalicized surface

INFINEON TECHNOLOGIES AG7 citations74
US6888244B2May 3, 2005

Interconnect arrangement and method for fabricating an interconnect arrangement

INFINEON TECHNOLOGIES AG9 citations74
US6864175B2Mar 8, 2005

Method for fabricating integrated circuit arrangements, and associated circuit arrangements, in particular tunnel contact elements

INFINEON TECHNOLOGIES AG9 citations74
US6315913B1Nov 13, 2001

Structuring method

INFINEON TECHNOLOGIES AG12 citations74
US6210595B1Apr 3, 2001

Method for producing structures having a high aspect ratio and structure having a high aspect ratio

INFINEON TECHNOLOGIES AG12 citations74
US10032670B2Jul 24, 2018

Plasma dicing of silicon carbide

INFINEON TECHNOLOGIES AG6 citations73
US9679773B1Jun 13, 2017

Method for thermal annealing and a semiconductor device formed by the method

INFINEON TECHNOLOGIES AG3 citations73
US9391263B2Jul 12, 2016

Semiconductor devices having insulating substrates and methods of formation thereof

INFINEON TECHNOLOGIES AG2 citations63
US8361884B2Jan 29, 2013

Plasma dicing and semiconductor devices formed thereof

INFINEON TECHNOLOGIES AG3 citations63
US6998338B2Feb 14, 2006

Method of producing an integrated circuit configuration

INFINEON TECHNOLOGIES AG2 citations63
US6828680B2Dec 7, 2004

Integrated circuit configuration using spacers as a diffusion barrier and method of producing such an integrated circuit configuration

INFINEON TECHNOLOGIES AG3 citations63
US6730562B2May 4, 2004

Method of patterning ferroelectric layers

INFINEON TECHNOLOGIES AG4 citations63
US6316802B1Nov 13, 2001

Easy to manufacture integrated semiconductor memory configuration with platinum electrodes

INFINEON TECHNOLOGIES AG5 citations63
US9275916B2Mar 1, 2016

Removable indicator structure in electronic chips of a common substrate for process adjustment

INFINEON TECHNOLOGIES AG2 citations62
US9219011B2Dec 22, 2015

Separation of chips on a substrate

INFINEON TECHNOLOGIES AG3 citations62
US9006109B2Apr 14, 2015

Semiconductor devices and methods for manufacturing semiconductor devices

INFINEON TECHNOLOGIES AG2 citations62
US7045070B1May 16, 2006

Method of producing an electrode configuration and method of electrically contacting the electrode configuration

INFINEON TECHNOLOGIES AG4 citations62
US6946386B2Sep 20, 2005

Process for producing ultrathin homogenous metal layers

INFINEON TECHNOLOGIES AG3 citations60
US7129173B2Oct 31, 2006

Process for producing and removing a mask layer

INFINEON TECHNOLOGIES AG3 citations58
US6566220B2May 20, 2003

Method for fabricating a semiconductor memory component

INFINEON TECHNOLOGIES AG3 citations58
US10490425B2Nov 26, 2019

Plasma systems and methods of processing using thereof

INFINEON TECHNOLOGIES AG0 citations52
US10236204B2Mar 19, 2019

Semiconductor processing system

INFINEON TECHNOLOGIES AG0 citations52
US10043640B2Aug 7, 2018

Process tools and methods of forming devices using process tools

INFINEON TECHNOLOGIES AG0 citations52
US10043683B2Aug 7, 2018

Plasma system, chuck and method of making a semiconductor device

INFINEON TECHNOLOGIES AG0 citations52
US9613848B2Apr 4, 2017

Dielectric structures with negative taper and methods of formation thereof

INFINEON TECHNOLOGIES AG0 citations52
US9608201B2Mar 28, 2017

Semiconductor devices having insulating substrates and methods of formation thereof

INFINEON TECHNOLOGIES AG0 citations52
US9012325B2Apr 21, 2015

Method of protecting sidewall surfaces of a semiconductor device

INFINEON TECHNOLOGIES AG0 citations52
US8993422B2Mar 31, 2015

Process tools and methods of forming devices using process tools

INFINEON TECHNOLOGIES AG0 citations52

ENGELHARDT MANFRED

8 patents

SIEMENS AG

4 patents

PHILIPS CORP

2 patents

BECKER FRANK

1 patent

BRUNNER HELMUT

1 patent

KOEHLER DANIEL

1 patent

Showing the top 50 of 70 patents by PatentIndex Score.