Inventor
CHEN YAN-HENG
TW16 patents
⚠️ This page may combine multiple inventors who share the name “CHEN YAN-HENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
15 patentsUS9589841B2Mar 7, 2017
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD6 citations72
US9899303B2Feb 20, 2018
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71
US9842758B2Dec 12, 2017
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations71
US8828796B1Sep 9, 2014
Semiconductor package and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations71
US9548219B2Jan 17, 2017
Semiconductor package and fabrication method thereof and carrier structure
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations65
US9666536B2May 30, 2017
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations51
US9224646B2Dec 29, 2015
Method for fabricating semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9117698B2Aug 25, 2015
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US10403567B2Sep 3, 2019
Fabrication method of electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9768140B2Sep 19, 2017
Method for fabricating package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9607941B2Mar 28, 2017
Conductive via structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9397081B2Jul 19, 2016
Fabrication method of semiconductor package having embedded semiconductor elements
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49
US9177859B2Nov 3, 2015
Semiconductor package having embedded semiconductor elements
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49
US9515040B2Dec 6, 2016
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40
US9337061B2May 10, 2016
Fabrication method of semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations38