Inventor

LIN CHUN-TANG

TW35 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHUN-TANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN CHUN-TANG

SILICONWARE PRECISION INDUSTRIES CO LTD

Semiconductor package and fabrication method thereof

Substrate structure with filling material formed in concave portion

Electronic package and fabrication method thereof

Package structure and fabrication method thereof

Method for fabricating semiconductor structure

Method of manufacturing substrate structure with filling material formed in concave portion

Semiconductor package and fabrication method thereof

Conductive bump structure with a plurality of metal layers

Electronic package and substrate structure having chamfers

Method for fabricating substrate structure

Substrate structure, electronic package having the same, and method for fabricating the same

Chip matching system and method thereof

Chip matching system and method thereof

Fabrication method of semiconductor package

Method for fabricating semiconductor package

Fabrication method of electronic package

Conductive via structure and fabrication method thereof

Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers

Fabrication method of semiconductor package

Fabrication method of semiconductor package

Substrate structure having chamfers

Method of fabricating semiconductor package having an interposer structure

Method of fabricating semiconductor package

Fabrication method of semiconductor package having embedded semiconductor elements

Semiconductor package, and interposer structure of the semiconductor package

Semiconductor package having embedded semiconductor elements

Semiconductor package and method of fabricating the same

Semiconductor package and fabrication method thereof

Method of testing a semiconductor package

Package structure and fabrication method thereof

Semiconductor package and fabrication method thereof

Package structure and fabrication method thereof

Fabrication method of semiconductor package

HUANG JUNG-PANG

Semiconductor package and fabrication method thereof

HUANG HUI-MIN

Semiconductor device and fabrication method thereof