Inventor

Liao yan-yi

TW3 patents

Patents

3 patents

US9397081B2Jul 19, 2016

Fabrication method of semiconductor package having embedded semiconductor elements

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49

US9177859B2Nov 3, 2015

Semiconductor package having embedded semiconductor elements

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49

US9337061B2May 10, 2016

Fabrication method of semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations38