Inventor
LIU HUNG-WEN
TW16 patents
⚠️ This page may combine multiple inventors who share the name “LIU HUNG-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
8 patentsUS8828796B1Sep 9, 2014
Semiconductor package and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations71
US8766456B2Jul 1, 2014
Method of fabricating a semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations61
US7459770B2Dec 2, 2008
Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structure
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations57
US9666536B2May 30, 2017
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations51
US9224646B2Dec 29, 2015
Method for fabricating semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9397081B2Jul 19, 2016
Fabrication method of semiconductor package having embedded semiconductor elements
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49
US9177859B2Nov 3, 2015
Semiconductor package having embedded semiconductor elements
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49
US9607974B2Mar 28, 2017
Package structure and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41
BENQ CORP
3 patentsMICRON TECHNOLOGY INC
2 patentsUS11710702B2Jul 25, 2023
Substrate-free semiconductor device assemblies with multiple semiconductor devices and methods for making the same
MICRON TECHNOLOGY INC2 citations72
US12211798B1Jan 28, 2025
Substrate-free semiconductor device assemblies with multiple semiconductor devices and methods for making the same
MICRON TECHNOLOGY INC0 citations61