Inventor
LIU WEN-KUEI
TW28 patents
⚠️ This page may combine multiple inventors who share the name “LIU WEN-KUEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
18 patentsUS9236446B2Jan 12, 2016
Barc-assisted process for planar recessing or removing of variable-height layers
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9281192B2Mar 8, 2016
CMP-friendly coatings for planar recessing or removing of variable-height layers
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US11069570B2Jul 20, 2021
Method for forming an interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10734240B2Aug 4, 2020
Method and equipment for performing CMP process
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US12368063B2Jul 22, 2025
Wafer taping apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901226B2Feb 13, 2024
Method for forming an interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11642754B2May 9, 2023
Slurry recycling for chemical mechanical polishing system
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11430677B2Aug 30, 2022
Wafer taping apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11312882B2Apr 26, 2022
CMP slurry solution for hardened fluid material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11244834B2Feb 8, 2022
Slurry recycling for chemical mechanical polishing system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011385B2May 18, 2021
CMP-friendly coatings for planar recessing or removing of variable-height layers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9852899B2Dec 26, 2017
Wafer back-side polishing system and method for integrated circuit device manufacturing processes
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9748109B2Aug 29, 2017
CMP-friendly coatings for planar recessing or removing of variable-height layers
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9559021B2Jan 31, 2017
Wafer back-side polishing system and method for integrated circuit device manufacturing processes
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9287127B2Mar 15, 2016
Wafer back-side polishing system and method for integrated circuit device manufacturing processes
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US9478431B2Oct 25, 2016
BARC-assisted process for planar recessing or removing of variable-height layers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10854468B2Dec 1, 2020
Method and equipment for performing CMP process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10774241B2Sep 15, 2020
CMP slurry solution for hardened fluid material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51