Inventor
LIEN KUO-CHENG
TW13 patents
⚠️ This page may combine multiple inventors who share the name “LIEN KUO-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS9236446B2Jan 12, 2016
Barc-assisted process for planar recessing or removing of variable-height layers
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9434047B2Sep 6, 2016
Retainer ring
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11312882B2Apr 26, 2022
CMP slurry solution for hardened fluid material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011385B2May 18, 2021
CMP-friendly coatings for planar recessing or removing of variable-height layers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9852899B2Dec 26, 2017
Wafer back-side polishing system and method for integrated circuit device manufacturing processes
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9748109B2Aug 29, 2017
CMP-friendly coatings for planar recessing or removing of variable-height layers
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9559021B2Jan 31, 2017
Wafer back-side polishing system and method for integrated circuit device manufacturing processes
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9287127B2Mar 15, 2016
Wafer back-side polishing system and method for integrated circuit device manufacturing processes
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US9478431B2Oct 25, 2016
BARC-assisted process for planar recessing or removing of variable-height layers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10774241B2Sep 15, 2020
CMP slurry solution for hardened fluid material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51