Inventor

CHEN YUNG-CHING

TW19 patents

⚠️ This page may combine multiple inventors who share the name “CHEN YUNG-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN YUNG-CHING

TAIWAN SEMICONDUCTOR MFG CO LTD

Gas-supply system and method

Package on package devices and methods of packaging semiconductor dies

Molded underfilling for package on package devices

Pad structure for enhanced bondability

Pad structure for enhanced bondability

Pad structure for enhanced bondability

Interconnect structure for CIS flip-chip bonding and methods for forming the same

Package on package devices and methods of packaging semiconductor dies

YU CHEN-HUA

Package on package devices and methods of packaging semiconductor dies

Package on package devices and methods of forming same

Interconnect structure for CIS flip-chip bonding and methods for forming the same

TAIWAN SEMICONDUCTOR MFG

Interconnect structure for CIS flip-chip bonding and methods for forming the same

Molded underfilling for package on package devices

LII MIRNG-JI

Rigid interconnect structures in package-on-package assemblies

CHEN YUNG-CHING

Engine

(unassigned)

Two stroke engine

SUNG MING-CHUNG

System and method for forming uniform rigid interconnect structures

MEDIATEK SINGAPORE PTE LTD

Semiconductor devices with flexibility in capacitor design for power noise reduction

SHEN HSIN-AN

Looped interconnect structure