Inventor

FURUSAWA AKIO

JP27 patents

⚠️ This page may combine multiple inventors who share the name “FURUSAWA AKIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FURUSAWA AKIO

PANASONIC IP MAN CO LTD

Mounting structure and nanoparticle mounting material

Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device

Solder alloy and junction structure using same

Solder alloy and bonded structure using the same

Solder alloy and package structure using same

Metal microparticle production method and metal microparticle production device

Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer

Solder alloy and mounted structure using same

Solder material and bonded structure

Solder material and bonded structure

Mounting structure and BGA ball

Mount structure

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Solder, solder paste and soldering method

Solder, electronic component mounted by soldering, and electronic circuit board

Method and apparatus for processing electronic parts

Solder, solder paste and soldering method

NAKAMURA TAICHI

Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body

Bonded structure and manufacturing method for bonded structure

Semiconductor device

FURUSAWA AKIO

Joint structure and electronic component

Joint structure, joining material, and method for producing joining material containing bismuth

Bonding material, electronic component, bonding structure and electronic device

PANASONIC CORP

Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead

Bonded structure and bonding material

HINE KIYOHIRO

Mounted structure and manufacturing method of mounted structure

Mounting structure

SAKATANI SHIGEAKI

Soldering material and electronic component assembly