Inventor

AN SANGHO

KR3 patents

⚠️ This page may combine multiple inventors who share the name “AN SANGHO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM GEUNWOO

1 patent

US9881827B2Jan 30, 2018

Substrate treating apparatus and substrate treating method

KIM GEUNWOO2 citations61

SAMSUNG ELECTRONICS CO LTD

1 patent

US10658326B2May 19, 2020

Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire

SAMSUNG ELECTRONICS CO LTD0 citations45

KWON HEUNGKYU

1 patent

US9390992B2Jul 12, 2016

Semiconductor packages including a metal layer between first and second semiconductor chips

KWON HEUNGKYU1 citations45