Inventor
KIM JONG RIP
KR10 patents
⚠️ This page may combine multiple inventors who share the name “KIM JONG RIP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
4 patentsUS10566289B2Feb 18, 2020
Fan-out semiconductor package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD4 citations72
US10600748B2Mar 24, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations71
US11011482B2May 18, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US10714437B2Jul 14, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
SAMSUNG ELECTRO MECH
4 patentsUS9929100B2Mar 27, 2018
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations71
US10448512B2Oct 15, 2019
Printed circuit board
SAMSUNG ELECTRO MECH1 citations60
US10104767B2Oct 16, 2018
Printed circuit board
SAMSUNG ELECTRO MECH0 citations48
US9786573B2Oct 10, 2017
Electronic component package
SAMSUNG ELECTRO MECH0 citations40