Inventor
OH KYUNG SEOB
KR21 patents
⚠️ This page may combine multiple inventors who share the name “OH KYUNG SEOB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
11 patentsUSD591695SMay 5, 2009
Light-emitting diode module
SAMSUNG ELECTRO MECH26 citations88
US9825003B2Nov 21, 2017
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH11 citations84
US10211149B2Feb 19, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH7 citations83
US7598528B2Oct 6, 2009
High power light emitting diode package and method of producing the same
SAMSUNG ELECTRO MECH12 citations83
US10170382B2Jan 1, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH2 citations72
US9905526B2Feb 27, 2018
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations72
US9929100B2Mar 27, 2018
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations71
US9881873B2Jan 30, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH5 citations71
US10224288B2Mar 5, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH1 citations60
US10154594B2Dec 11, 2018
Printed circuit board
SAMSUNG ELECTRO MECH1 citations52
US8957319B2Feb 17, 2015
Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same
SAMSUNG ELECTRO MECH1 citations45
SAMSUNG ELECTRONICS CO LTD
6 patentsUS10741461B2Aug 11, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations72
US10566289B2Feb 18, 2020
Fan-out semiconductor package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD4 citations72
US10600748B2Mar 24, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations71
US11011482B2May 18, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US10714437B2Jul 14, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US10622322B2Apr 14, 2020
Fan-out semiconductor package and method of manufacturing the fan-out semiconductor
SAMSUNG ELECTRONICS CO LTD0 citations41