Inventor

WANG KUN-CHIH

TW28 patents

⚠️ This page may combine multiple inventors who share the name “WANG KUN-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG KUN-CHIH

UNITED MICROELECTRONICS CORP

Semiconductor chip capable of implementing wire bonding over active circuits

Deposition method with improved step coverage

Method of fabricating a copper capping layer

Semiconductor chip capable of implementing wire bonding over active circuits

Method of forming pad openings and fuse openings

Method fabricating metal interconnected structure

Method of fabricating a metal-oxide-semiconductor transistor with a metal gate

Self-aligned via process for preventing poison via formation

Via structure and method of manufacture

Semiconductor chip capable of implementing wire bonding over active circuits

Semiconductor chip capable of implementing wire bonding over active circuits

Parasitic capacitance-preventing dummy solder bump structure and method of making the same

Bonding pad structure

Fuse structure integrated wire bonding on the low k interconnect and method for making the same

Method of forming bonding pad

Method of manufacturing multilevel metal interconnect

Process of making unlanded vias

Semiconductor chip capable of implementing wire bonding over active circuits

Method for manufacturing wafer level chip scale package structure

Physical vapor deposition device for forming a metallic layer on a semiconductor wafer

Chemical plasma treatment for rounding tungsten surface spires

Pre-process before cutting a wafer and method of cutting a wafer

HEWLETT PACKARD DEVELOPMENT CO

Hinge for foldable components

Stylus holders

Rolling elements-based pivoting supports for keyboards

Wireless chargers

ASIA OPTICAL CO INC

Optical lens molding apparatus and precision molding apparatus

Method and the device for making high precision coating of insert for glass molding