P

Inventor

YEW TRI-RUNG

TW91 patents
⚠️ This page may combine multiple inventors who share the name “YEW TRI-RUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

49 patents
US5801094ASep 1, 1998

Dual damascene process

UNITED MICROELECTRONICS CORP178 citations99
US6010931AJan 4, 2000

Planarization technique for DRAM cell capacitor electrode

UNITED MICROELECTRONICS CORP88 citations98
US6159845ADec 12, 2000

Method for manufacturing dielectric layer

UNITED MICROELECTRONICS CORP111 citations97
US6306722B1Oct 23, 2001

Method for fabricating shallow trench isolation structure

UNITED MICROELECTRONICS CORP53 citations96
US6265780B1Jul 24, 2001

Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit

UNITED MICROELECTRONICS CORP65 citations96
US6265313B1Jul 24, 2001

Method of manufacturing copper interconnect

UNITED MICROELECTRONICS CORP59 citations96
US6184142B1Feb 6, 2001

Process for low k organic dielectric film etch

UNITED MICROELECTRONICS CORP81 citations96
US6078492AJun 20, 2000

Structure of a capacitor in a semiconductor device having a self align contact window which has a slanted sidewall

UNITED MICROELECTRONICS CORP62 citations96
US5994181ANov 30, 1999

Method for forming a DRAM cell electrode

UNITED MICROELECTRONICS CORP57 citations96
US5990015ANov 23, 1999

Dual damascence process

UNITED MICROELECTRONICS CORP60 citations96
US5960299ASep 28, 1999

Method of fabricating a shallow-trench isolation structure in integrated circuit

UNITED MICROELECTRONICS CORP77 citations96
US5956598ASep 21, 1999

Method for fabricating a shallow-trench isolation structure with a rounded corner in integrated circuit

UNITED MICROELECTRONICS CORP63 citations96
US5753559AMay 19, 1998

Method for growing hemispherical grain silicon

UNITED MICROELECTRONICS CORP59 citations96
US6017817AJan 25, 2000

Method of fabricating dual damascene

UNITED MICROELECTRONICS CORP83 citations95
US5998251ADec 7, 1999

Process and structure for embedded DRAM

UNITED MICROELECTRONICS CORP68 citations95
US6291288B1Sep 18, 2001

Method of fabricating a thin and structurally-undefective dielectric structure for a storage capacitor in dynamic random-access memory

UNITED MICROELECTRONICS CORP26 citations93
US6191028B1Feb 20, 2001

Method of patterning dielectric

UNITED MICROELECTRONICS CORP30 citations93
US6159661ADec 12, 2000

Dual damascene process

UNITED MICROELECTRONICS CORP33 citations93
US6150251ANov 21, 2000

Method of fabricating gate

UNITED MICROELECTRONICS CORP25 citations93
US6146941ANov 14, 2000

Method for fabricating a capacitor in a semiconductor device

UNITED MICROELECTRONICS CORP21 citations93
US6133086AOct 17, 2000

Fabrication method of a tantalum pentoxide dielectric layer for a DRAM capacitor

UNITED MICROELECTRONICS CORP24 citations93
US6114200ASep 5, 2000

Method of fabricating a dynamic random access memory device

UNITED MICROELECTRONICS CORP32 citations93
US6084304AJul 4, 2000

Structure of metallization

UNITED MICROELECTRONICS CORP25 citations93
US6077769AJun 20, 2000

Method of fabricating a daul damascene structure

UNITED MICROELECTRONICS CORP46 citations93
US6069066AMay 30, 2000

Method of forming bonding pad

UNITED MICROELECTRONICS CORP23 citations93
US6060379AMay 9, 2000

Method of forming dual damascene structure

UNITED MICROELECTRONICS CORP19 citations93
US6027994AFeb 22, 2000

Method to fabricate a dual metal-damascene structure in a substrate

UNITED MICROELECTRONICS CORP28 citations93
US6025264AFeb 15, 2000

Fabricating method of a barrier layer

UNITED MICROELECTRONICS CORP32 citations93
US6001733ADec 14, 1999

Method of forming a dual damascene with dummy metal lines

UNITED MICROELECTRONICS CORP54 citations93
US5994183ANov 30, 1999

Method for forming charge storage structure

UNITED MICROELECTRONICS CORP49 citations93
US5930618AJul 27, 1999

Method of Making High-K Dielectrics for embedded DRAMS

UNITED MICROELECTRONICS CORP32 citations93
US6475865B1Nov 5, 2002

Method of fabricating semiconductor device

UNITED MICROELECTRONICS CORP36 citations92
US6254676B1Jul 3, 2001

Method for manufacturing metal oxide semiconductor transistor having raised source/drain

UNITED MICROELECTRONICS CORP28 citations92
US6251783B1Jun 26, 2001

Method of manufacturing shallow trench isolation

UNITED MICROELECTRONICS CORP20 citations92
US6235606B1May 22, 2001

Method of fabricating shallow trench isolation

UNITED MICROELECTRONICS CORP29 citations92
US6221712B1Apr 24, 2001

Method for fabricating gate oxide layer

UNITED MICROELECTRONICS CORP26 citations92
US6140192AOct 31, 2000

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP30 citations92
US6013579AJan 11, 2000

Self-aligned via process for preventing poison via formation

UNITED MICROELECTRONICS CORP20 citations92
US6001414ADec 14, 1999

Dual damascene processing method

UNITED MICROELECTRONICS CORP34 citations92
US6037206AMar 14, 2000

Method of fabricating a capacitor of a dynamic random access memory

UNITED MICROELECTRONICS CORP29 citations90
US6242334B1Jun 5, 2001

Multi-step spacer formation of semiconductor devices

UNITED MICROELECTRONICS CORP24 citations89
US6221746B1Apr 24, 2001

Method for forming a poly gate structure

UNITED MICROELECTRONICS CORP24 citations89
US10079277B2Sep 18, 2018

Method of fabricating metal-insulator-metal capacitor

UNITED MICROELECTRONICS CORP9 citations84
US6680248B2Jan 20, 2004

Method of forming dual damascene structure

UNITED MICROELECTRONICS CORP14 citations84
US6593223B1Jul 15, 2003

Method of forming dual damascene structure

UNITED MICROELECTRONICS CORP13 citations84
US6221744B1Apr 24, 2001

Method for forming a gate

UNITED MICROELECTRONICS CORP18 citations84
US6080660AJun 27, 2000

Via structure and method of manufacture

UNITED MICROELECTRONICS CORP16 citations84
US5981395ANov 9, 1999

Method of fabricating an unlanded metal via of multi-level interconnection

UNITED MICROELECTRONICS CORP19 citations84
US5976931ANov 2, 1999

Method for increasing capacitance

UNITED MICROELECTRONICS CORP15 citations82

(unassigned)

1 patent

Showing the top 50 of 91 patents by PatentIndex Score.