Inventor
BEH TEONG KEAT
MY3 patents
Patents
3 patentsUS10317938B2Jun 11, 2019
Apparatus utilizing computer on package construction
INTEL CORP2 citations68
US9552995B2Jan 24, 2017
Electrical interconnect for an electronic package
INTEL CORP0 citations51
US9606949B1Mar 28, 2017
Universal scalable system: on-the-fly system performance conversion via PC-on-a-card and USB for smart devices and IoT enabling
INTEL CORP1 citations50