Inventor

KONG JACKSON CHUNG PENG

MY118 patents

⚠️ This page may combine multiple inventors who share the name “KONG JACKSON CHUNG PENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KONG JACKSON CHUNG PENG

INTEL CORP

Electronic device with flexible hinge

Systems in packages including wide-band phased-array antennas and methods of assembling same

Systems in packages including wide-band phased-array antennas and methods of assembling same

Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same

Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same

Low-profile hinge for an electronic device

Portable computing device with low profile hinge

Micro through-silicon via for transistor density scaling

Multi-orientation display device

Ring-in-ring configurable-capacitance stiffeners and methods of assembling same

Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal traces

Stepped interposer for stacked chip package

Hybrid ball grid array package for high speed interconnects

Three dimensional foldable substrate with vertical side interface

Semiconductor package with hybrid through-silicon-vias

Integrated bridge for die-to-die interconnects

Substrate with gradiated dielectric for reducing impedance mismatch

Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same

Electronic packages with stacked sitffeners and methods of assembling same

Overpass dice stacks and methods of using same

Integrated circuit packages with conductive element having cavities housing electrically connected embedded components

Interposer with flexible portion

Micro-hinge for an electronic device

Semiconductor package with package components disposed on a package substrate within a footprint of a die

Microelectronic device package having alternately stacked die

Capacitive compensation structures using partially meshed ground planes

Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus

Microelectronic device having an air core inductor

Micro through-silicon via for transistor density scaling

Stacked through-silicon vias for multi-device packages

Power delivery for embedded interconnect bridge devices and methods

Foldable fabric-based packaging solution

Packaged die stacks with stacked capacitors and methods of assembling same

Over-molded IC package with in-mold capacitor

Ring-in-ring configurable-capacitance stiffeners and methods of assembling same

Packaged die stacks with stacked capacitors and methods of assembling same

Flexible packaging architecture

Apparatus utilizing computer on package construction

Semiconductor package, semiconductor system, and method of forming semiconductor package

Flexible shield for semiconductor devices

Semiconductor packages for stacked memory-on-package (SMOP) and methods of manufacturing the same

Asymmetrical laminated circuit boards for improved electrical performance

Semiconductor package with hybrid mold layers

Hybrid boards with embedded planes

Composite bridge die-to-die interconnects for integrated-circuit packages

Micro through-silicon via for transistor density scaling

Micro through-silicon via for transistor density scaling

Integrated bridge for die-to-die interconnects

Interposer structures and methods for 2.5D and 3D packaging

CHEAH BOK ENG

Method to enable controlled side chip interconnection for 3D integrated packaging system