Inventor
KUBO AKIRA
JP61 patents
⚠️ This page may combine multiple inventors who share the name “KUBO AKIRA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
11 patentsUS5835177ANov 10, 1998
Array substrate with bus lines takeout/terminal sections having multiple conductive layers
TOSHIBA KK186 citations98
US5811835ASep 22, 1998
Thin-film transistor with edge inclined gates and liquid crystal display device furnished with the same
TOSHIBA KK120 citations98
US6078366AJun 20, 2000
Array substrate comprising semiconductor contact layers having same outline as signal lines
TOSHIBA KK91 citations97
US6235561B1May 22, 2001
Method of manufacturing thin-film transistors
TOSHIBA KK68 citations96
US6028652AFeb 22, 2000
Array substrate for display device and manufacturing method thereof
TOSHIBA KK43 citations96
US5966190AOct 12, 1999
Array substrate for displaying device with capacitor lines having particular connections
TOSHIBA KK63 citations96
US5677745AOct 14, 1997
LCD with electrostatic discharge projections
TOSHIBA KK55 citations96
US6528357B2Mar 4, 2003
Method of manufacturing array substrate
TOSHIBA KK115 citations95
US6624864B1Sep 23, 2003
Liquid crystal display device, matrix array substrate, and method for manufacturing matrix array substrate
TOSHIBA KK104 citations93
US6541389B1Apr 1, 2003
Method of patterning a thin layer by chemical etching
TOSHIBA KK27 citations90
US5646756AJul 8, 1997
Liquid crystal display device with a protecting film that partially overlaps a display pixel electrode
TOSHIBA KK19 citations84
NEC CORP
10 patentsUS6132292AOct 17, 2000
Chemical mechanical polishing method suitable for highly accurate planarization
NEC CORP38 citations93
US6048764AApr 11, 2000
Method for producing semiconductor device with capacitor stacked
NEC CORP34 citations93
US5938502AAug 17, 1999
Polishing method of substrate and polishing device therefor
NEC CORP20 citations93
US5786275AJul 28, 1998
Process of fabricating wiring structure having metal plug twice polished under different conditions
NEC CORP45 citations93
US6361708B1Mar 26, 2002
Method and apparatus for polishing a metal film
NEC CORP22 citations92
US5840631ANov 24, 1998
Method of manufacturing semiconductor device
NEC CORP48 citations92
US6447381B1Sep 10, 2002
Polishing apparatus
NEC CORP8 citations74
US6316364B1Nov 13, 2001
Polishing method and polishing solution
NEC CORP14 citations74
US6309961B1Oct 30, 2001
Method of forming damascene wiring in a semiconductor device
NEC CORP3 citations63
US6274480B1Aug 14, 2001
Method of Fabricating semiconductor device
NEC CORP3 citations63
SHINTO PAINT CO LTD
7 patentsUS5503952AApr 2, 1996
Method for manufacture of color filter and liquid crystal display
SHINTO PAINT CO LTD79 citations96
US4333807AJun 8, 1982
Reverse coating process
SHINTO PAINT CO LTD22 citations82
US4499225AFeb 12, 1985
Coating composition
SHINTO PAINT CO LTD23 citations79
US4259163AMar 31, 1981
Process for applying anticorrosive coating onto automobile body
SHINTO PAINT CO LTD26 citations78
US5693705ADec 2, 1997
Matted electrodeposition coating composition and a method of producing a matted electrodeposition coating
SHINTO PAINT CO LTD11 citations71
US4591609AMay 27, 1986
Method for producing water-dispersible compositions
SHINTO PAINT CO LTD17 citations67
US5573876ANov 12, 1996
Method for manufacturing color filter and liquid crystal display
SHINTO PAINT CO LTD5 citations62
TYCO ELECTRONICS JAPAN G K
4 patentsUS9178297B2Nov 3, 2015
Flat cable connector
TYCO ELECTRONICS JAPAN G K10 citations84
US7922539B2Apr 12, 2011
Floating connector with an impedance adjusting member
TYCO ELECTRONICS JAPAN G K10 citations84
US9203172B2Dec 1, 2015
Electrical connector assembly and electrical connector used therefor
TYCO ELECTRONICS JAPAN G K6 citations72
US10193254B2Jan 29, 2019
Connector assembly and connector
TYCO ELECTRONICS JAPAN G K1 citations62
NEC ELECTRONICS CORP
4 patentsUS7303463B2Dec 4, 2007
Semiconductor wafer polishing apparatus, and method of polishing semiconductor wafer
NEC ELECTRONICS CORP6 citations74
US6723626B2Apr 20, 2004
Method of manufacturing semiconductor device
NEC ELECTRONICS CORP10 citations74
US6551914B1Apr 22, 2003
Method of forming polish stop by plasma treatment for interconnection
NEC ELECTRONICS CORP11 citations73
US6992007B2Jan 31, 2006
Method of cleaning damascene structure of semiconductor wafer during fabrication of semiconductor device
NEC ELECTRONICS CORP1 citations52
TYCO ELECTRONICS AMP KK
3 patentsUS7273382B2Sep 25, 2007
Electrical connector and electrical connector assembly
TYCO ELECTRONICS AMP KK69 citations98
US7189090B2Mar 13, 2007
Coupler for flat cables and electrical connector assembly
TYCO ELECTRONICS AMP KK28 citations92
US7186126B2Mar 6, 2007
Floating electrical connector
TYCO ELECTRONICS AMP KK28 citations89
TOPPAN PRINTING CO LTD
3 patentsUS6955839B2Oct 18, 2005
Laminated composite, information recording medium, and member of imparting forgery-preventing characteristic
TOPPAN PRINTING CO LTD19 citations82
US9272308B2Mar 1, 2016
Method of manufacturing optical device
TOPPAN PRINTING CO LTD8 citations77
US10471760B2Nov 12, 2019
Multiple-image display body
TOPPAN PRINTING CO LTD0 citations51
SGL TECHNIC INC
2 patentsTYCO ELECTRONICS EC K K
1 patentHONDA MOTOR CO LTD
1 patentHIROSE ELECTRIC CO LTD
1 patentKONICA MINOLTA SENSING INC
1 patentMITSUBISHI TANABE PHARMA CORP
1 patentMITSUBISHI ELECTRIC CORP
1 patentShowing the top 50 of 61 patents by PatentIndex Score.