Inventor
RIEMER DOUGLAS P
US27 patents
⚠️ This page may combine multiple inventors who share the name “RIEMER DOUGLAS P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HUTCHINSON TECHNOLOGY
26 patentsUS12044219B2Jul 23, 2024
Sensor shift structures in optical image stabilization suspensions
HUTCHINSON TECHNOLOGY7 citations85
US11199182B2Dec 14, 2021
Sensor shift structures in optical image stabilization suspensions
HUTCHINSON TECHNOLOGY14 citations85
US10640879B2May 5, 2020
High aspect ratio electroplated structures and anisotropic electroplating processes
HUTCHINSON TECHNOLOGY5 citations84
US9935251B1Apr 3, 2018
LED chip packaging with high performance thermal dissipation
HUTCHINSON TECHNOLOGY3 citations73
US12147059B2Nov 19, 2024
Sensor shift structures in optical image stabilization suspensions
HUTCHINSON TECHNOLOGY2 citations72
US11867575B2Jan 9, 2024
Miniature pressure/force sensor with integrated leads
HUTCHINSON TECHNOLOGY1 citations72
US11782286B2Oct 10, 2023
Shape memory alloy wire attachment structures for a suspension assembly
HUTCHINSON TECHNOLOGY1 citations72
US11243127B2Feb 8, 2022
Miniature pressure/force sensor with integrated leads
HUTCHINSON TECHNOLOGY2 citations72
US11387033B2Jul 12, 2022
High-aspect ratio electroplated structures and anisotropic electroplating processes
HUTCHINSON TECHNOLOGY2 citations69
US12378687B2Aug 5, 2025
High aspect ratio electroplated structures and anisotropic electroplating processes
HUTCHINSON TECHNOLOGY0 citations62
US11873564B2Jan 16, 2024
Etch chemistry for metallic materials
HUTCHINSON TECHNOLOGY0 citations62
US11322806B2May 3, 2022
Sensored battery electrode
HUTCHINSON TECHNOLOGY1 citations62
US11109493B2Aug 31, 2021
Electroless plating activation
HUTCHINSON TECHNOLOGY0 citations62
US12216013B2Feb 4, 2025
Miniature pressure/force sensor with integrated leads
HUTCHINSON TECHNOLOGY0 citations61
US12173423B2Dec 24, 2024
Gold electroplating solution and method
HUTCHINSON TECHNOLOGY0 citations61
US10925663B2Feb 23, 2021
Metallized components and surgical instruments
HUTCHINSON TECHNOLOGY1 citations61
US10625083B2Apr 21, 2020
Metallized components and surgical instruments
HUTCHINSON TECHNOLOGY1 citations61
US10570525B2Feb 25, 2020
Gold electroplating solution and method
HUTCHINSON TECHNOLOGY1 citations61
US11791521B2Oct 17, 2023
Electrode tabs and methods of forming
HUTCHINSON TECHNOLOGY0 citations59
US12195870B2Jan 14, 2025
Microetch neutralizer chemistry for Ni—Au plating defect elimination
HUTCHINSON TECHNOLOGY0 citations55
US12159983B2Dec 3, 2024
Sensored battery pouch
HUTCHINSON TECHNOLOGY0 citations52
US11674235B2Jun 13, 2023
Plating method to reduce or eliminate voids in solder applied without flux
HUTCHINSON TECHNOLOGY0 citations52
US11932948B2Mar 19, 2024
Electroless nickel etch chemistry, method of etching and pretreatment
HUTCHINSON TECHNOLOGY0 citations50
US12460291B2Nov 4, 2025
Surface treatment producing high conductivity vias with simultaneous polymer adhesion
HUTCHINSON TECHNOLOGY0 citations46
US11898264B2Feb 13, 2024
Treatment methods and solutions for improving adhesion of gold electroplating on metal surfaces
HUTCHINSON TECHNOLOGY0 citations44
US11713514B2Aug 1, 2023
Systems for electroplating and methods of use thereof
HUTCHINSON TECHNOLOGY0 citations37