Inventor
WAN CHENG-TIEN
TW18 patents
⚠️ This page may combine multiple inventors who share the name “WAN CHENG-TIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
9 patentsUS11923460B2Mar 5, 2024
Semiconductor structure
MEDIATEK INC1 citations72
US11450756B2Sep 20, 2022
Manufacturing method of semiconductor chip
MEDIATEK INC1 citations72
US11404587B2Aug 2, 2022
Semiconductor structure
MEDIATEK INC3 citations72
US11189694B2Nov 30, 2021
Semiconductor devices and methods of forming the same
MEDIATEK INC2 citations72
US10790380B2Sep 29, 2020
Semiconductor chip and manufacturing method thereof
MEDIATEK INC2 citations72
US12272755B2Apr 8, 2025
Semiconductor structure
MEDIATEK INC0 citations62
US11916108B2Feb 27, 2024
Semiconductor devices and methods of forming the same
MEDIATEK INC0 citations62
US11600700B2Mar 7, 2023
Semiconductor devices and methods of forming the same
MEDIATEK INC0 citations62
US12237401B2Feb 25, 2025
Semiconductor chip
MEDIATEK INC0 citations61
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS10084069B2Sep 25, 2018
Apparatus and method for FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9559099B2Jan 31, 2017
Apparatus and method for FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US9922828B2Mar 20, 2018
Apparatus and method for FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9722051B2Aug 1, 2017
Apparatus and method for FinFETs
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9450098B2Sep 20, 2016
FinFET having superlattice stressor
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52