Inventor
PHAM XUYEN
US28 patents
⚠️ This page may combine multiple inventors who share the name “PHAM XUYEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
19 patentsUS6939212B1Sep 6, 2005
Porous material air bearing platen for chemical mechanical planarization
LAM RES CORP36 citations92
US6953750B1Oct 11, 2005
Methods and systems for controlling belt surface temperature and slurry temperature in linear chemical mechanical planarization
LAM RES CORP25 citations91
US6806100B1Oct 19, 2004
Molded end point detection window for chemical mechanical planarization
LAM RES CORP23 citations91
US6896586B2May 24, 2005
Method and apparatus for heating polishing pad
LAM RES CORP26 citations89
US6475332B1Nov 5, 2002
Interlocking chemical mechanical polishing system
LAM RES CORP44 citations89
US6447380B1Sep 10, 2002
Polishing apparatus and substrate retainer ring providing continuous slurry distribution
LAM RES CORP28 citations89
US7054719B2May 30, 2006
System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
LAM RES CORP11 citations82
US6896600B1May 24, 2005
Liquid dispense manifold for chemical-mechanical polisher
LAM RES CORP16 citations82
US6732017B2May 4, 2004
System and method for point of use delivery, control and mixing chemical and slurry for CMP/cleaning system
LAM RES CORP15 citations82
US6949016B1Sep 27, 2005
Gimballed conditioning apparatus
LAM RES CORP11 citations74
US6872128B1Mar 29, 2005
System, method and apparatus for applying liquid to a CMP polishing pad
LAM RES CORP10 citations74
US6746313B1Jun 8, 2004
Polishing head assembly in an apparatus for chemical mechanical planarization
LAM RES CORP7 citations74
US6712670B2Mar 30, 2004
Method and apparatus for applying downward force on wafer during CMP
LAM RES CORP7 citations72
US6869339B2Mar 22, 2005
Polishing pad and method of manufacture
LAM RES CORP3 citations63
US7040954B1May 9, 2006
Methods of and apparatus for controlling polishing surface characteristics for chemical mechanical polishing
LAM RES CORP6 citations62
US6761626B2Jul 13, 2004
Air platen for leading edge and trailing edge control
LAM RES CORP3 citations62
US6821195B1Nov 23, 2004
Carrier head having location optimized vacuum holes
LAM RES CORP2 citations56
US7018276B2Mar 28, 2006
Air platen for leading edge and trailing edge control
LAM RES CORP0 citations51
US7040970B2May 9, 2006
Apparatus and method for distributing a polishing fluid
LAM RES CORP1 citations48