Inventor

OKABE TAKEO

JP31 patents

⚠️ This page may combine multiple inventors who share the name “OKABE TAKEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OKABE TAKEO

NIPPON MINING CO

Copper alloy sputtering target and semiconductor element wiring

Sputtering target

Copper alloy sputtering target process for producing the same and semiconductor element wiring

Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it

Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode

Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode

Copper electroplating method, pure copper anode for copper electroplating, and semiconductor wafer plated thereby with little particle adhesion

Hafnium alloy target and process for producing the same

Packaging device and packaging method for hollow cathode type sputtering target

OKABE TAKEO

Copper alloy sputtering target and semiconductor element wiring

Copper or copper alloy target/copper alloy backing plate assembly

Hafnium alloy target

Hafnium alloy target

Hafnium alloy target and process for producing the same

Copper alloy sputtering target and method for manufacturing the target

Copper alloy sputtering target, process for producing the same and semiconductor element wiring

JX NIPPON MINING & METALS CORP

High purity copper—manganese alloy sputtering target

Electrolytic copper plating method, pure copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode

Tungsten silicide target member and method for manufacturing same, and method for manufacturing tungsten silicide film

Copper alloy sputtering target and semiconductor element wiring

High-purity copper sputtering target

Tungsten sintered compact sputtering target and tungsten film formed using same target

Tungsten sintered compact sputtering target and method for producing same

NIKKO MATERIALS CO LTD

Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles

Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor

Sputtering target producing few particles

NAGATA KENICHI

Sputtering target and manufacturing method therefor

High-purity copper-manganese-alloy sputtering target

HITACHI ASTEMO LTD

Method of manufacturing steering shaft

MAKINO NOBUHITO

Titanium target for sputtering

AIBA AKIHIRO

Electrolytic copper plating method, phosphorous copper anode for electrolytic copper plating, and semiconductor wafer having low particle adhesion plated with said method and anode