Inventor
FJELSTAD JOSEPH
US119 patents
Patents
50 patentsUS6856235B2Feb 15, 2005
Methods for manufacturing resistors using a sacrificial layer
TESSERA INC129 citations99
US6847101B2Jan 25, 2005
Microelectronic package having a compliant layer with bumped protrusions
TESSERA INC129 citations99
US6583444B2Jun 24, 2003
Semiconductor packages having light-sensitive chips
TESSERA INC270 citations99
US6324754B1Dec 4, 2001
Method for fabricating microelectronic assemblies
TESSERA INC164 citations99
US6294830B1Sep 25, 2001
Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer
TESSERA INC302 citations99
US6284563B1Sep 4, 2001
Method of making compliant microelectronic assemblies
TESSERA INC135 citations99
US6239384B1May 29, 2001
Microelectric lead structures with plural conductors
TESSERA INC234 citations99
US6228686B1May 8, 2001
Method of fabricating a microelectronic assembly using sheets with gaps to define lead regions
TESSERA INC123 citations99
US6211572B1Apr 3, 2001
Semiconductor chip package with fan-in leads
TESSERA INC282 citations99
US6133072AOct 17, 2000
Microelectronic connector with planar elastomer sockets
TESSERA INC233 citations99
US6130116AOct 10, 2000
Method of encapsulating a microelectronic assembly utilizing a barrier
TESSERA INC148 citations99
US6093584AJul 25, 2000
Method for encapsulating a semiconductor package having apertures through a sacrificial layer and contact pads
TESSERA INC157 citations99
US6086386AJul 11, 2000
Flexible connectors for microelectronic elements
TESSERA INC248 citations99
US6001671ADec 14, 1999
Methods for manufacturing a semiconductor package having a sacrificial layer
TESSERA INC712 citations99
US5989936ANov 23, 1999
Microelectronic assembly fabrication with terminal formation from a conductive layer
TESSERA INC215 citations99
US5980270ANov 9, 1999
Soldering with resilient contacts
TESSERA INC249 citations99
US5834339ANov 10, 1998
Methods for providing void-free layers for semiconductor assemblies
TESSERA INC143 citations99
US5812378ASep 22, 1998
Microelectronic connector for engaging bump leads
TESSERA INC239 citations99
US5802699ASep 8, 1998
Methods of assembling microelectronic assembly with socket for engaging bump leads
TESSERA INC434 citations99
US5776796AJul 7, 1998
Method of encapsulating a semiconductor package
TESSERA INC173 citations99
US5763941AJun 9, 1998
Connection component with releasable leads
TESSERA INC119 citations99
US5615824AApr 1, 1997
Soldering with resilient contacts
TESSERA INC217 citations99
US5590460AJan 7, 1997
Method of making multilayer circuit
TESSERA INC172 citations99
US7872344B2Jan 18, 2011
Microelectronic assemblies having compliant layers
TESSERA INC64 citations98
US6848173B2Feb 1, 2005
Microelectric packages having deformed bonded leads and methods therefor
TESSERA INC82 citations98
US6690186B2Feb 10, 2004
Methods and structures for electronic probing arrays
TESSERA INC85 citations98
US6586955B2Jul 1, 2003
Methods and structures for electronic probing arrays
TESSERA INC137 citations98
US6499216B1Dec 31, 2002
Methods and structures for electronic probing arrays
TESSERA INC134 citations98
US6253992B1Jul 3, 2001
Solder ball placement fixtures and methods
TESSERA INC95 citations98
US6221750B1Apr 24, 2001
Fabrication of deformable leads of microelectronic elements
TESSERA INC91 citations98
US6205660B1Mar 27, 2001
Method of making an electronic contact
TESSERA INC152 citations98
US6007349ADec 28, 1999
Flexible contact post and post socket and associated methods therefor
TESSERA INC125 citations98
US6002168ADec 14, 1999
Microelectronic component with rigid interposer
TESSERA INC204 citations98
US5934914AAug 10, 1999
Microelectronic contacts with asperities and methods of making same
TESSERA INC117 citations98
US5632631AMay 27, 1997
Microelectronic contacts with asperities and methods of making same
TESSERA INC280 citations98
US6885106B1Apr 26, 2005
Stacked microelectronic assemblies and methods of making same
TESSERA INC78 citations97
US7528008B2May 5, 2009
Method of electrically connecting a microelectronic component
TESSERA INC25 citations96
US7408260B2Aug 5, 2008
Microelectronic assemblies having compliant layers
TESSERA INC52 citations96
US7165316B2Jan 23, 2007
Methods for manufacturing resistors using a sacrificial layer
TESSERA INC36 citations96
US7138299B2Nov 21, 2006
Method of electrically connecting a microelectronic component
TESSERA INC34 citations96
US7112879B2Sep 26, 2006
Microelectronic assemblies having compliant layers
TESSERA INC25 citations96
US7095054B2Aug 22, 2006
Semiconductor package having light sensitive chips
TESSERA INC55 citations96
US6888168B2May 3, 2005
Semiconductor package having light sensitive chips
TESSERA INC51 citations96
US6847107B2Jan 25, 2005
Image forming apparatus with improved transfer efficiency
TESSERA INC31 citations96
US6821815B2Nov 23, 2004
Method of assembling a semiconductor chip package
TESSERA INC66 citations96
US6821821B2Nov 23, 2004
Methods for manufacturing resistors using a sacrificial layer
TESSERA INC40 citations96
US6780747B2Aug 24, 2004
Methods for providing void-free layers for semiconductor assemblies
TESSERA INC40 citations96
US6700072B2Mar 2, 2004
Electrical connection with inwardly deformable contacts
TESSERA INC58 citations96
US6653172B2Nov 25, 2003
Methods for providing void-free layers for semiconductor assemblies
TESSERA INC32 citations96
US6573609B2Jun 3, 2003
Microelectronic component with rigid interposer
TESSERA INC59 citations96
Showing the top 50 of 119 patents by PatentIndex Score.