P

Inventor

WATANABE EIJI

JP105 patents
⚠️ This page may combine multiple inventors who share the name “WATANABE EIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJITSU LTD

16 patents
US6255740B1Jul 3, 2001

Semiconductor device having a lead portion with outer connecting terminals

FUJITSU LTD122 citations99
US5656550AAug 12, 1997

Method of producing a semicondutor device having a lead portion with outer connecting terminal

FUJITSU LTD366 citations99
US6218281B1Apr 17, 2001

Semiconductor device with flip chip bonding pads and manufacture thereof

FUJITSU LTD162 citations98
US6025650AFeb 15, 2000

Semiconductor device including a frame terminal

FUJITSU LTD220 citations98
US6794273B2Sep 21, 2004

Semiconductor device and manufacturing method thereof

FUJITSU LTD81 citations97
US6232147B1May 15, 2001

Method for manufacturing semiconductor device with pad structure

FUJITSU LTD133 citations97
US5969424AOct 19, 1999

Semiconductor device with pad structure

FUJITSU LTD258 citations97
US6781224B2Aug 24, 2004

Semiconductor device and package including forming pyramid mount protruding through silicon substrate

FUJITSU LTD42 citations96
US6344407B1Feb 5, 2002

Method of manufacturing solder bumps and solder joints using formic acid

FUJITSU LTD75 citations96
US6566239B2May 20, 2003

Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating

FUJITSU LTD38 citations93
US7417326B2Aug 26, 2008

Semiconductor device and manufacturing method of the same

FUJITSU LTD17 citations92
US6732911B2May 11, 2004

Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system

FUJITSU LTD35 citations92
US6614113B2Sep 2, 2003

Semiconductor device and method for producing the same

FUJITSU LTD37 citations92
US6472763B2Oct 29, 2002

Semiconductor device with bumps for pads

FUJITSU LTD26 citations92
US6462415B1Oct 8, 2002

Semiconductor device as an object of thickness reduction

FUJITSU LTD51 citations92
US7095045B2Aug 22, 2006

Semiconductor device and manufacturing method thereof

FUJITSU LTD11 citations79

USUI KOKUSAI SANGYO KK

9 patents

YASKAWA DENKI SEISAKUSHO KK

4 patents

MITSUBISHI ELECTRIC CORP

3 patents

JEOL LTD

3 patents

TERUMO CORP

3 patents

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

2 patents

BABCOCK HITACHI KK

2 patents

AGENCY IND SCIENCE TECHN

2 patents

TOYOTA MOTOR CO LTD

1 patent

YASAKAWA DENKI KK

1 patent

METEORA SYSTEM CO LTD

1 patent

FUJIFILM CORP

1 patent

PANASONIC CORP

1 patent

TERUMO KABUSHIKI KAISHI

1 patent

Showing the top 50 of 105 patents by PatentIndex Score.