Inventor
TSUTSUMI YASUTSUGU
JP12 patents
Patents
12 patentsUS5059379AOct 22, 1991
Method of resin sealing semiconductor devices
MITSUBISHI ELECTRIC CORP208 citations96
US5108278AApr 28, 1992
Resin sealing apparatus
MITSUBISHI ELECTRIC CORP23 citations92
US5336272AAug 9, 1994
Method for molding a semiconductor package on a continuous leadframe
MITSUBISHI ELECTRIC CORP22 citations91
US5074779ADec 24, 1991
Mold for resin-sealing a semiconductor device
MITSUBISHI ELECTRIC CORP40 citations91
US5366364ANov 22, 1994
Plastic molding apparatus
MITSUBISHI ELECTRIC CORP23 citations89
US6224810B1May 1, 2001
Method of plastic molding
MITSUBISHI ELECTRIC CORP5 citations73
US5375989ADec 27, 1994
Apparatus for plastic encapsulation of a semiconductor element
MITSUBISHI ELECTRIC CORP9 citations73
US5281121AJan 25, 1994
Resin sealing apparatus
MITSUBISHI ELECTRIC CORP9 citations73
US4915608AApr 10, 1990
Device for resin sealing semiconductor devices
MITSUBISHI ELECTRIC CORP12 citations71
US5662848ASep 2, 1997
Plastic molding method for semiconductor devices
MITSUBISHI ELECTRIC CORP6 citations70
US5134458AJul 28, 1992
Long size lead frame for semiconductor elements
MITSUBISHI ELECTRIC CORP5 citations61
US4983111AJan 8, 1991
Device for resin sealing semiconductor devices
MITSUBISHI ELECTRIC CORP3 citations60