Inventor
BICKFORD HARRY R
US12 patents
⚠️ This page may combine multiple inventors who share the name “BICKFORD HARRY R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS5134460AJul 28, 1992
Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding
IBM265 citations99
US5374454ADec 20, 1994
Method for conditioning halogenated polymeric materials and structures fabricated therewith
IBM71 citations96
US5028983AJul 2, 1991
Multilevel integrated circuit packaging structures
IBM78 citations93
US5480841AJan 2, 1996
Process of multilayer conductor chip packaging
IBM36 citations92
US5399902AMar 21, 1995
Semiconductor chip packaging structure including a ground plane
IBM25 citations92
US4939570AJul 3, 1990
High power, pluggable tape automated bonding package
IBM49 citations92
US4832255AMay 23, 1989
Precision solder transfer method and means
IBM34 citations92
US5318803AJun 7, 1994
Conditioning of a substrate for electroless plating thereon
IBM48 citations91
US4956605ASep 11, 1990
Tab mounted chip burn-in apparatus
IBM32 citations89
US4937006AJun 26, 1990
Method and apparatus for fluxless solder bonding
IBM43 citations89
US5205461AApr 27, 1993
Method and apparatus for fluxless solder bonding
IBM16 citations72