Inventor

CANFIELD DENNIS A

US3 patents

Patents

3 patents

US5229550AJul 20, 1993

Encapsulated circuitized power core alignment and lamination

IBM170 citations97

US5129142AJul 14, 1992

Encapsulated circuitized power core alignment and lamination

IBM135 citations96

US5318803AJun 7, 1994

Conditioning of a substrate for electroless plating thereon

IBM48 citations91