P

Inventor

TISDALE STEPHEN L

US19 patents
⚠️ This page may combine multiple inventors who share the name “TISDALE STEPHEN L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

18 patents
US5443865AAug 22, 1995

Method for conditioning a substrate for subsequent electroless metal deposition

IBM56 citations96
US5374454ADec 20, 1994

Method for conditioning halogenated polymeric materials and structures fabricated therewith

IBM71 citations96
US5591285AJan 7, 1997

Fluorinated carbon polymer composites

IBM38 citations95
US5397863AMar 14, 1995

Fluorinated carbon polymer composites

IBM35 citations95
US5824157AOct 20, 1998

Fluid jet impregnation

IBM21 citations92
US5725668AMar 10, 1998

Expandable fluid treatment device for tublar surface treatments

IBM22 citations92
US5571852ANov 5, 1996

Fluorinated carbon polymer composites

IBM20 citations92
US5556899ASep 17, 1996

Fluorinated carbon polymer composites

IBM28 citations92
US5318803AJun 7, 1994

Conditioning of a substrate for electroless plating thereon

IBM48 citations91
US5242713ASep 7, 1993

Method for conditioning an organic polymeric material

IBM28 citations91
US4554182ANov 19, 1985

Method for conditioning a surface of a dielectric substrate for electroless plating

IBM50 citations91
US5203955AApr 20, 1993

Method for etching an organic polymeric material

IBM28 citations90
US5158645AOct 27, 1992

Method of external circuitization of a circuit panel

IBM28 citations88
US4904506AFeb 27, 1990

Copper deposition from electroless plating bath

IBM19 citations79
US5135779AAug 4, 1992

Method for conditioning an organic polymeric material

IBM11 citations74
US5919596AJul 6, 1999

Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making

IBM12 citations73
US5462628AOct 31, 1995

Method for bonding two surfaces together

IBM12 citations73
US4534797AAug 13, 1985

Method for providing an electroless copper plating bath in the take mode

IBM7 citations73

HONEYWELL ADVANCED CIRCUITS IN

1 patent