P

Inventor

WANG DAVID W

US41 patents
⚠️ This page may combine multiple inventors who share the name “WANG DAVID W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

21 patents
US5126192AJun 30, 1992

Flame retardant, low dielectric constant microsphere filled laminate

IBM151 citations98
US5194930AMar 16, 1993

Dielectric composition and solder interconnection structure for its use

IBM143 citations97
US4999699AMar 12, 1991

Solder interconnection structure and process for making

IBM137 citations97
US5250848AOct 5, 1993

Solder interconnection structure

IBM61 citations96
US5089440AFeb 18, 1992

Solder interconnection structure and process for making

IBM62 citations96
US4745215AMay 17, 1988

Fluorine containing dicyanate resins

IBM74 citations96
US5103293AApr 7, 1992

Electronic circuit packages with tear resistant organic cores

IBM108 citations93
US5102970AApr 7, 1992

Liquid epoxy polymer composition based on cycloaliphatic amine cured difunctional/polyfunctional epoxy blends

IBM22 citations93
US5605781AFeb 25, 1997

Photosensitive composition with cyanate esters and use thereof

IBM18 citations92
US5319244AJun 7, 1994

Triazine thin film adhesives

IBM20 citations92
US5055342AOct 8, 1991

Fluorinated polymeric composition, fabrication thereof and use thereof

IBM69 citations92
US5288542AFeb 22, 1994

Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof

IBM33 citations90
US6790473B2Sep 14, 2004

Lead protective coating composition, process and structure thereof

IBM38 citations89
US5607744AMar 4, 1997

Coated filler and use thereof

IBM22 citations89
US5378306AJan 3, 1995

Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof

IBM17 citations80
US5061779AOct 29, 1991

Liquid epoxy polymer composition and use thereof based on cycloaliphatic amine cured difunctional/polyfunctional resin blends

IBM15 citations74
US5015719AMay 14, 1991

Aromatic dicyanate/aromatic diepoxy compositions, cured products and methods

IBM10 citations74
US5471096ANov 28, 1995

Solder interconnection from a composition containing a mixture of dicyanates

IBM16 citations73
US5464726ANov 7, 1995

Photosensitive composition and use thereof

IBM5 citations73
US5206074AApr 27, 1993

Adhesives on polymide films and methods of preparing them

IBM12 citations72
US5614250AMar 25, 1997

Coated filler and use thereof

IBM10 citations71

FIBERA INC

9 patents

AMERICAN CYANAMID CO

7 patents

SCHLUMBERGER TECHNOLOGY CORP

2 patents

HANDSHAKE VR INC

1 patent

CORNELL RES FOUNDATION INC

1 patent