Inventor
SUMMA WILLIAM J
US14 patents
Patents
14 patentsUS5126192AJun 30, 1992
Flame retardant, low dielectric constant microsphere filled laminate
IBM151 citations98
US4745215AMay 17, 1988
Fluorine containing dicyanate resins
IBM74 citations96
US5153986AOct 13, 1992
Method for fabricating metal core layers for a multi-layer circuit board
IBM131 citations95
US4728751AMar 1, 1988
Flexible electrical connection and method of making same
IBM79 citations95
US5103293AApr 7, 1992
Electronic circuit packages with tear resistant organic cores
IBM108 citations93
US5319244AJun 7, 1994
Triazine thin film adhesives
IBM20 citations92
US4873123AOct 10, 1989
Flexible electrical connection and method of making same
IBM27 citations92
US4659425AApr 21, 1987
Continuous process for the manufacture of printed circuit boards
IBM74 citations91
US5288542AFeb 22, 1994
Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
IBM33 citations90
US4697923AOct 6, 1987
Method for visual inspection of multilayer printed circuit boards
IBM28 citations90
US5378306AJan 3, 1995
Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
IBM17 citations80
US5015719AMay 14, 1991
Aromatic dicyanate/aromatic diepoxy compositions, cured products and methods
IBM10 citations74
US5206074AApr 27, 1993
Adhesives on polymide films and methods of preparing them
IBM12 citations72
US5250347AOct 5, 1993
Mechanically enhanced, high impact strength triazine resins, and method of preparing same
IBM4 citations54