Inventor

GEORGE REED A

US5 patents

⚠️ This page may combine multiple inventors who share the name “GEORGE REED A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOTOROLA INC

4 patents

US5439162AAug 8, 1995

Direct chip attachment structure and method

MOTOROLA INC162 citations96

US5386624AFeb 7, 1995

Method for underencapsulating components on circuit supporting substrates

MOTOROLA INC150 citations95

US5625224AApr 29, 1997

Method and apparatus for an integrated circuit chip carrier having improved mounting pad density

MOTOROLA INC8 citations70

US5475379ADec 12, 1995

Solid phase conformal coating suitable for use with electronic devices

MOTOROLA INC11 citations70

MOTOROLA CORP

1 patent

US5829668ANov 3, 1998

Method for forming solder bumps on bond pads

MOTOROLA CORP43 citations90