Inventor
MANGOLD RICHARD L
US4 patents
Patents
4 patentsUS5386624AFeb 7, 1995
Method for underencapsulating components on circuit supporting substrates
MOTOROLA INC150 citations95
US5436028AJul 25, 1995
Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards
MOTOROLA INC71 citations93
US5452656ASep 26, 1995
Apparatus for selectively applying solder paste to multiple types of printed circuit boards
MOTOROLA INC37 citations90
US5475379ADec 12, 1995
Solid phase conformal coating suitable for use with electronic devices
MOTOROLA INC11 citations70