Inventor
BLADON JOHN J
US16 patents
⚠️ This page may combine multiple inventors who share the name “BLADON JOHN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHIPLEY CO
10 patentsUS4919768AApr 24, 1990
Electroplating process
SHIPLEY CO65 citations96
US4895739AJan 23, 1990
Pretreatment for electroplating process
SHIPLEY CO67 citations96
US4725314AFeb 16, 1988
Catalytic metal of reduced particle size
SHIPLEY CO64 citations96
US4652311AMar 24, 1987
Catalytic metal of reduced particle size
SHIPLEY CO80 citations96
US5007990AApr 16, 1991
Electroplating process
SHIPLEY CO38 citations92
US4634468AJan 6, 1987
Catalytic metal of reduced particle size
SHIPLEY CO42 citations92
US4952286AAug 28, 1990
Electroplating process
SHIPLEY CO39 citations88
US5276290AJan 4, 1994
Electroplating process and composition
SHIPLEY CO18 citations82
US5207888AMay 4, 1993
Electroplating process and composition
SHIPLEY CO12 citations73
US5017742AMay 21, 1991
Printed circuit board
SHIPLEY CO13 citations73
SHIPLEY CO LLC
4 patentsUS6265020B1Jul 24, 2001
Fluid delivery systems for electronic device manufacture
SHIPLEY CO LLC20 citations89
US5425873AJun 20, 1995
Electroplating process
SHIPLEY CO LLC20 citations89
US6036835AMar 14, 2000
Method of microetching a conductive polymer on multilayer circuit boards
SHIPLEY CO LLC5 citations61
US6017967AJan 25, 2000
Electroplating process and composition
SHIPLEY CO LLC3 citations60