Inventor
SONNENBERG WADE
US25 patents
⚠️ This page may combine multiple inventors who share the name “SONNENBERG WADE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHIPLEY CO LLC
16 patentsUS6911068B2Jun 28, 2005
Plating bath and method for depositing a metal layer on a substrate
SHIPLEY CO LLC35 citations92
US6736954B2May 18, 2004
Plating bath and method for depositing a metal layer on a substrate
SHIPLEY CO LLC27 citations92
US6652731B2Nov 25, 2003
Plating bath and method for depositing a metal layer on a substrate
SHIPLEY CO LLC28 citations92
US6899829B2May 31, 2005
Conductive polymer colloidal compositions with selectivity for non-conductive surfaces
SHIPLEY CO LLC24 citations91
US6752878B2Jun 22, 2004
Process for treating adhesion promoted metal surfaces
SHIPLEY CO LLC23 citations91
US6174647B1Jan 16, 2001
Metallization process and component
SHIPLEY CO LLC20 citations91
US6827839B2Dec 7, 2004
Plating bath analysis
SHIPLEY CO LLC33 citations90
US6773573B2Aug 10, 2004
Plating bath and method for depositing a metal layer on a substrate
SHIPLEY CO LLC31 citations90
US5425873AJun 20, 1995
Electroplating process
SHIPLEY CO LLC20 citations89
US6440642B1Aug 27, 2002
Dielectric composition
SHIPLEY CO LLC44 citations87
US6123995ASep 26, 2000
Method of manufacture of multilayer circuit boards
SHIPLEY CO LLC14 citations72
US6039859AMar 21, 2000
Method for electroplating using stabilized dispersions of conductive particles
SHIPLEY CO LLC7 citations72
US5800739ASep 1, 1998
Stabilized dispersions of graphite particles
SHIPLEY CO LLC11 citations72
US5667662ASep 16, 1997
Electroplating process and composition
SHIPLEY CO LLC11 citations72
US6036835AMar 14, 2000
Method of microetching a conductive polymer on multilayer circuit boards
SHIPLEY CO LLC5 citations61
US6017967AJan 25, 2000
Electroplating process and composition
SHIPLEY CO LLC3 citations60
SHIPLEY CO
7 patentsUS5252196AOct 12, 1993
Copper electroplating solutions and processes
SHIPLEY CO134 citations96
US5223118AJun 29, 1993
Method for analyzing organic additives in an electroplating bath
SHIPLEY CO94 citations93
US5051154ASep 24, 1991
Additive for acid-copper electroplating baths to increase throwing power
SHIPLEY CO67 citations92
US4932518AJun 12, 1990
Method and apparatus for determining throwing power of an electroplating solution
SHIPLEY CO25 citations92
US5068013ANov 26, 1991
Electroplating composition and process
SHIPLEY CO34 citations90
US4897165AJan 30, 1990
Electroplating composition and process for plating through holes in printed circuit boards
SHIPLEY CO21 citations82
US5004525AApr 2, 1991
Copper electroplating composition
SHIPLEY CO12 citations73