Inventor
FIORDALICE ROBERT W
US18 patents
⚠️ This page may combine multiple inventors who share the name “FIORDALICE ROBERT W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
16 patentsUS5578523ANov 26, 1996
Method for forming inlaid interconnects in a semiconductor device
MOTOROLA INC201 citations99
US5534462AJul 9, 1996
Method for forming a plug and semiconductor device having the same
MOTOROLA INC135 citations99
US5391517AFeb 21, 1995
Process for forming copper interconnect structure
MOTOROLA INC300 citations99
US6187682B1Feb 13, 2001
Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of material
MOTOROLA INC94 citations97
US6218302B1Apr 17, 2001
Method for forming a semiconductor device
MOTOROLA INC222 citations96
US5814557ASep 29, 1998
Method of forming an interconnect structure
MOTOROLA INC124 citations96
US5677231AOct 14, 1997
Method for providing trench isolation
MOTOROLA INC66 citations96
US5652176AJul 29, 1997
Method for providing trench isolation and borderless contact
MOTOROLA INC67 citations96
US5525542AJun 11, 1996
Method for making a semiconductor device having anti-reflective coating
MOTOROLA INC65 citations95
US5420072AMay 30, 1995
Method for forming a conductive interconnect in an integrated circuit
MOTOROLA INC101 citations95
US5358901AOct 25, 1994
Process for forming an intermetallic layer
MOTOROLA INC53 citations95
US5429989AJul 4, 1995
Process for fabricating a metallization structure in a semiconductor device
MOTOROLA INC40 citations92
US5783485AJul 21, 1998
Process for fabricating a metallized interconnect
MOTOROLA INC27 citations91
US5633199AMay 27, 1997
Process for fabricating a metallized interconnect structure in a semiconductor device
MOTOROLA INC49 citations91
US5580823ADec 3, 1996
Process for fabricating a collimated metal layer and contact structure in a semiconductor device
MOTOROLA INC33 citations89
US6218733B1Apr 17, 2001
Semiconductor device having a titanium-aluminum compound
MOTOROLA INC11 citations70