P

Inventor

FIORDALICE ROBERT W

US18 patents
⚠️ This page may combine multiple inventors who share the name “FIORDALICE ROBERT W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOTOROLA INC

16 patents
US5578523ANov 26, 1996

Method for forming inlaid interconnects in a semiconductor device

MOTOROLA INC201 citations99
US5534462AJul 9, 1996

Method for forming a plug and semiconductor device having the same

MOTOROLA INC135 citations99
US5391517AFeb 21, 1995

Process for forming copper interconnect structure

MOTOROLA INC300 citations99
US6187682B1Feb 13, 2001

Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of material

MOTOROLA INC94 citations97
US6218302B1Apr 17, 2001

Method for forming a semiconductor device

MOTOROLA INC222 citations96
US5814557ASep 29, 1998

Method of forming an interconnect structure

MOTOROLA INC124 citations96
US5677231AOct 14, 1997

Method for providing trench isolation

MOTOROLA INC66 citations96
US5652176AJul 29, 1997

Method for providing trench isolation and borderless contact

MOTOROLA INC67 citations96
US5525542AJun 11, 1996

Method for making a semiconductor device having anti-reflective coating

MOTOROLA INC65 citations95
US5420072AMay 30, 1995

Method for forming a conductive interconnect in an integrated circuit

MOTOROLA INC101 citations95
US5358901AOct 25, 1994

Process for forming an intermetallic layer

MOTOROLA INC53 citations95
US5429989AJul 4, 1995

Process for fabricating a metallization structure in a semiconductor device

MOTOROLA INC40 citations92
US5783485AJul 21, 1998

Process for fabricating a metallized interconnect

MOTOROLA INC27 citations91
US5633199AMay 27, 1997

Process for fabricating a metallized interconnect structure in a semiconductor device

MOTOROLA INC49 citations91
US5580823ADec 3, 1996

Process for fabricating a collimated metal layer and contact structure in a semiconductor device

MOTOROLA INC33 citations89
US6218733B1Apr 17, 2001

Semiconductor device having a titanium-aluminum compound

MOTOROLA INC11 citations70

KLA TENCOR TECH CORP

1 patent

KLA TENCOR CORP

1 patent