Inventor
MORI KAZUTAKA
JP49 patents
⚠️ This page may combine multiple inventors who share the name “MORI KAZUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
21 patentsUS6656644B2Dec 2, 2003
Manufacturing method of photomask and photomask
HITACHI LTD64 citations95
US6029220AFeb 22, 2000
Pipelined semiconductor devices suitable for ultra large scale integration
HITACHI LTD43 citations93
US5657264AAug 12, 1997
Semiconductor memory
HITACHI LTD18 citations93
US5362998ANov 8, 1994
Composite circuit of bipolar transistors and MOS transistors and semiconductor integrated circuit device using the same
HITACHI LTD28 citations93
US6392277B1May 21, 2002
Semiconductor device
HITACHI LTD23 citations92
US6194915B1Feb 27, 2001
Semiconductor integrated circuit device and process for manufacturing the same
HITACHI LTD31 citations92
US5408676AApr 18, 1995
Parallel data processing system with plural-system bus configuration capable of fast data communication between processors by using common buses
HITACHI LTD49 citations92
US5285414AFeb 8, 1994
Semiconductor memory having transistors which drive data lines in accordance with values of write data and column select signal
HITACHI LTD18 citations82
US6596656B2Jul 22, 2003
Manufacturing use of photomasks with an opaque pattern comprising an organic layer photoabsorptive to exposure light with wavelengths exceeding 200 NM
HITACHI LTD11 citations74
US6467004B1Oct 15, 2002
Pipelined semiconductor devices suitable for ultra large scale integration
HITACHI LTD5 citations74
US6937068B2Aug 30, 2005
Semiconductor integrated circuit
HITACHI LTD8 citations73
US6846598B2Jan 25, 2005
Manufacturing method of photomask and photomask
HITACHI LTD6 citations73
US6636075B2Oct 21, 2003
Semiconductor integrated circuit and its fabrication method
HITACHI LTD10 citations73
US5038056AAug 6, 1991
Output circuit
HITACHI LTD12 citations73
US7522083B2Apr 21, 2009
Semiconductor device having D/A conversion portion
HITACHI LTD7 citations72
US5590361ADec 31, 1996
Microprocessor having an effective BiCMOS extra multiple input complex logic circuit
HITACHI LTD6 citations63
US6670201B2Dec 30, 2003
Manufacturing method of semiconductor device
HITACHI LTD6 citations62
US6359472B2Mar 19, 2002
Semiconductor integrated circuit and its fabrication method
HITACHI LTD2 citations62
US7310266B2Dec 18, 2007
Semiconductor device having memory cells implemented with bipolar-transistor-antifuses operating in a first and second mode
HITACHI LTD1 citations50
US7129549B2Oct 31, 2006
Semiconductor integrated circuit device
HITACHI LTD1 citations46
US7629669B2Dec 8, 2009
Semiconductor apparatus
HITACHI LTD0 citations36
MITSUBISHI HEAVY IND LTD
11 patentsUS7354663B2Apr 8, 2008
Thermal barrier coating, manufacturing method thereof, turbine part and gas turbine
MITSUBISHI HEAVY IND LTD22 citations92
US7859100B2Dec 28, 2010
Thermal barrier coating material, thermal barrier member, and member coated with thermal barrier and method for manufacturing the same
MITSUBISHI HEAVY IND LTD12 citations83
US7655326B2Feb 2, 2010
Thermal barrier coating material and method for production thereof, gas turbine member using the thermal barrier coating material, and gas turbine
MITSUBISHI HEAVY IND LTD11 citations83
US6916551B2Jul 12, 2005
Thermal barrier coating material, gas turbine parts and gas turbine
MITSUBISHI HEAVY IND LTD10 citations74
US5639572AJun 17, 1997
Interconnector material for electrochemical cells
MITSUBISHI HEAVY IND LTD12 citations69
US4770908ASep 13, 1988
Process for preparing porous ceramic membrane
MITSUBISHI HEAVY IND LTD13 citations66
US10259034B2Apr 16, 2019
Slurry for forming mold, mold and method for producing mold
MITSUBISHI HEAVY IND LTD0 citations51
US10245636B2Apr 2, 2019
Method for manufacturing core, and method for manufacturing turbine member in which core is acquired by said core manufacturing method
MITSUBISHI HEAVY IND LTD0 citations51
US10166598B2Jan 1, 2019
Precision-casting core, precision-casting core manufacturing method, and precision-casting mold
MITSUBISHI HEAVY IND LTD0 citations50
US8021718B2Sep 20, 2011
Heat treatment method
MITSUBISHI HEAVY IND LTD1 citations47
US8370084B2Feb 5, 2013
Method for estimating physical property of ceramic, method for estimating physical property of thermal barrier coating, method for estimating remaining lifetime of thermal barrier coating, method for estimating remaining lifetime of high-temperature member, and physical property acquiring apparatus
MITSUBISHI HEAVY IND LTD0 citations40
RENESAS TECH CORP
9 patentsUS6727152B2Apr 27, 2004
Semiconductor device
RENESAS TECH CORP5 citations74
US6958292B2Oct 25, 2005
Method of manufacturing integrated circuit
RENESAS TECH CORP4 citations73
US7109076B2Sep 19, 2006
Method of manufacturing semiconductor integrated circuit device, and semiconductor integrated circuit device made by its method
RENESAS TECH CORP9 citations71
US7361530B2Apr 22, 2008
Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light
RENESAS TECH CORP3 citations63
US7205222B2Apr 17, 2007
Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light
RENESAS TECH CORP1 citations63
US6849540B2Feb 1, 2005
Method of fabricating semiconductor integrated circuit device and method of producing a multi-chip module that includes patterning with a photomask that uses metal for blocking exposure light and a photomask that uses organic resin for blocking exposure light
RENESAS TECH CORP2 citations63
US6936406B2Aug 30, 2005
Method of manufacturing integrated circuit
RENESAS TECH CORP2 citations62
US6902868B2Jun 7, 2005
Method of manufacturing integrated circuit
RENESAS TECH CORP3 citations62
US6794207B2Sep 21, 2004
Method of manufacturing integrated circuit
RENESAS TECH CORP3 citations62