P

Inventor

MORI KAZUTAKA

JP49 patents
⚠️ This page may combine multiple inventors who share the name “MORI KAZUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

21 patents
US6656644B2Dec 2, 2003

Manufacturing method of photomask and photomask

HITACHI LTD64 citations95
US6029220AFeb 22, 2000

Pipelined semiconductor devices suitable for ultra large scale integration

HITACHI LTD43 citations93
US5657264AAug 12, 1997

Semiconductor memory

HITACHI LTD18 citations93
US5362998ANov 8, 1994

Composite circuit of bipolar transistors and MOS transistors and semiconductor integrated circuit device using the same

HITACHI LTD28 citations93
US6392277B1May 21, 2002

Semiconductor device

HITACHI LTD23 citations92
US6194915B1Feb 27, 2001

Semiconductor integrated circuit device and process for manufacturing the same

HITACHI LTD31 citations92
US5408676AApr 18, 1995

Parallel data processing system with plural-system bus configuration capable of fast data communication between processors by using common buses

HITACHI LTD49 citations92
US5285414AFeb 8, 1994

Semiconductor memory having transistors which drive data lines in accordance with values of write data and column select signal

HITACHI LTD18 citations82
US6596656B2Jul 22, 2003

Manufacturing use of photomasks with an opaque pattern comprising an organic layer photoabsorptive to exposure light with wavelengths exceeding 200 NM

HITACHI LTD11 citations74
US6467004B1Oct 15, 2002

Pipelined semiconductor devices suitable for ultra large scale integration

HITACHI LTD5 citations74
US6937068B2Aug 30, 2005

Semiconductor integrated circuit

HITACHI LTD8 citations73
US6846598B2Jan 25, 2005

Manufacturing method of photomask and photomask

HITACHI LTD6 citations73
US6636075B2Oct 21, 2003

Semiconductor integrated circuit and its fabrication method

HITACHI LTD10 citations73
US5038056AAug 6, 1991

Output circuit

HITACHI LTD12 citations73
US7522083B2Apr 21, 2009

Semiconductor device having D/A conversion portion

HITACHI LTD7 citations72
US5590361ADec 31, 1996

Microprocessor having an effective BiCMOS extra multiple input complex logic circuit

HITACHI LTD6 citations63
US6670201B2Dec 30, 2003

Manufacturing method of semiconductor device

HITACHI LTD6 citations62
US6359472B2Mar 19, 2002

Semiconductor integrated circuit and its fabrication method

HITACHI LTD2 citations62
US7310266B2Dec 18, 2007

Semiconductor device having memory cells implemented with bipolar-transistor-antifuses operating in a first and second mode

HITACHI LTD1 citations50
US7129549B2Oct 31, 2006

Semiconductor integrated circuit device

HITACHI LTD1 citations46
US7629669B2Dec 8, 2009

Semiconductor apparatus

HITACHI LTD0 citations36

MITSUBISHI HEAVY IND LTD

11 patents
US7354663B2Apr 8, 2008

Thermal barrier coating, manufacturing method thereof, turbine part and gas turbine

MITSUBISHI HEAVY IND LTD22 citations92
US7859100B2Dec 28, 2010

Thermal barrier coating material, thermal barrier member, and member coated with thermal barrier and method for manufacturing the same

MITSUBISHI HEAVY IND LTD12 citations83
US7655326B2Feb 2, 2010

Thermal barrier coating material and method for production thereof, gas turbine member using the thermal barrier coating material, and gas turbine

MITSUBISHI HEAVY IND LTD11 citations83
US6916551B2Jul 12, 2005

Thermal barrier coating material, gas turbine parts and gas turbine

MITSUBISHI HEAVY IND LTD10 citations74
US5639572AJun 17, 1997

Interconnector material for electrochemical cells

MITSUBISHI HEAVY IND LTD12 citations69
US4770908ASep 13, 1988

Process for preparing porous ceramic membrane

MITSUBISHI HEAVY IND LTD13 citations66
US10259034B2Apr 16, 2019

Slurry for forming mold, mold and method for producing mold

MITSUBISHI HEAVY IND LTD0 citations51
US10245636B2Apr 2, 2019

Method for manufacturing core, and method for manufacturing turbine member in which core is acquired by said core manufacturing method

MITSUBISHI HEAVY IND LTD0 citations51
US10166598B2Jan 1, 2019

Precision-casting core, precision-casting core manufacturing method, and precision-casting mold

MITSUBISHI HEAVY IND LTD0 citations50
US8021718B2Sep 20, 2011

Heat treatment method

MITSUBISHI HEAVY IND LTD1 citations47
US8370084B2Feb 5, 2013

Method for estimating physical property of ceramic, method for estimating physical property of thermal barrier coating, method for estimating remaining lifetime of thermal barrier coating, method for estimating remaining lifetime of high-temperature member, and physical property acquiring apparatus

MITSUBISHI HEAVY IND LTD0 citations40

RENESAS TECH CORP

9 patents
US6727152B2Apr 27, 2004

Semiconductor device

RENESAS TECH CORP5 citations74
US6958292B2Oct 25, 2005

Method of manufacturing integrated circuit

RENESAS TECH CORP4 citations73
US7109076B2Sep 19, 2006

Method of manufacturing semiconductor integrated circuit device, and semiconductor integrated circuit device made by its method

RENESAS TECH CORP9 citations71
US7361530B2Apr 22, 2008

Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light

RENESAS TECH CORP3 citations63
US7205222B2Apr 17, 2007

Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light

RENESAS TECH CORP1 citations63
US6849540B2Feb 1, 2005

Method of fabricating semiconductor integrated circuit device and method of producing a multi-chip module that includes patterning with a photomask that uses metal for blocking exposure light and a photomask that uses organic resin for blocking exposure light

RENESAS TECH CORP2 citations63
US6936406B2Aug 30, 2005

Method of manufacturing integrated circuit

RENESAS TECH CORP2 citations62
US6902868B2Jun 7, 2005

Method of manufacturing integrated circuit

RENESAS TECH CORP3 citations62
US6794207B2Sep 21, 2004

Method of manufacturing integrated circuit

RENESAS TECH CORP3 citations62

AISIN SEIKI

2 patents

NAMBA KATSUMI

1 patent

TORIGOE TAIJI

1 patent

DOW CORNING TORAY CO LTD

1 patent

ASAEDA MASASHI

1 patent

TOYOTA MOTOR CO LTD

1 patent

AISIN CORP

1 patent