Inventor

OGAWA CHIHIRO

JP15 patents

⚠️ This page may combine multiple inventors who share the name “OGAWA CHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC CORP

13 patents

US6104021AAug 15, 2000

Solid state image sensing element improved in sensitivity and production cost, process of fabrication thereof and solid state image sensing device using the same

NEC CORP44 citations95

US6291811B1Sep 18, 2001

Solid state image sensing element improved in sensitivity and production cost, process of fabrication thereof and solid state image sensing device using the same

NEC CORP28 citations92

US6188119B1Feb 13, 2001

Semiconductor device having barrier metal layer between a silicon electrode and metal electrode and manufacturing method for same

NEC CORP21 citations92

US6097433AAug 1, 2000

Solid state imaging apparatus having a plurality of metal wirings for supplying driving pulses to transfer electrodes of vertical CCD registers

NEC CORP17 citations82

US6312970B1Nov 6, 2001

Fabrication of CCD type solid state image pickup device having double-structured charge transfer electrodes

NEC CORP7 citations73

US6194749B1Feb 27, 2001

CCD type solid state image pickup device having double-structured charge transfer electrodes

NEC CORP7 citations73

US6090640AJul 18, 2000

CCD-type solid state image sensor with a wiring arrangement that improves flatness

NEC CORP2 citations62

US5426067AJun 20, 1995

Method for manufacturing semiconductor device with reduced junction capacitance

NEC CORP6 citations62

US6114718ASep 5, 2000

Solid state image sensor and its fabrication

NEC CORP1 citations51

MITSUI TOATSU CHEMICALS

2 patents

US5324771AJun 28, 1994

Polypropylene resin compositions, coating process for moldings thereof and its coated moldings

MITSUI TOATSU CHEMICALS7 citations72

US5395893AMar 7, 1995

Polypropylene resin compositions, coating process for moldings thereof and its coated moldings

MITSUI TOATSU CHEMICALS3 citations61

OGAWA CHIHIRO

NEC CORP

Solid state image sensing element improved in sensitivity and production cost, process of fabrication thereof and solid state image sensing device using the same

Solid state image sensing element improved in sensitivity and production cost, process of fabrication thereof and solid state image sensing device using the same

Semiconductor device having barrier metal layer between a silicon electrode and metal electrode and manufacturing method for same

Solid state imaging apparatus having a plurality of metal wirings for supplying driving pulses to transfer electrodes of vertical CCD registers

Fabrication of CCD type solid state image pickup device having double-structured charge transfer electrodes

CCD type solid state image pickup device having double-structured charge transfer electrodes

Method of making CCD-type solid-state pickup device

CCD-type solid-state pickup device and its fabrication method

Fabrication process for solid-state image pick-up device with CCD register

Semiconductor device

CCD-type solid state image sensor with a wiring arrangement that improves flatness

Method for manufacturing semiconductor device with reduced junction capacitance

Solid state image sensor and its fabrication

MITSUI TOATSU CHEMICALS

Polypropylene resin compositions, coating process for moldings thereof and its coated moldings

Polypropylene resin compositions, coating process for moldings thereof and its coated moldings