Inventor

LIU SHUR-FEN

TW50 patents

⚠️ This page may combine multiple inventors who share the name “LIU SHUR-FEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU SHUR-FEN

TAIWAN UNION TECHNOLOGY CORP

Resin composition and uses of the same

Metal-clad laminate and manufacturing method of the same

Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same

Fluororesin composition, and resin sheet, laminate and printed circuit board

Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the same

Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the same

Resin composition and uses of the same

Adhesive composition and uses of the same

Metal-clad laminate

Method of manufacturing metal-clad laminate and uses of the same

Dielectric composite and uses thereof

Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same

Resin composition and uses of the same

Resin composition and uses of the same

Resin Composition and uses of the same

Metal-clad laminate, printed circuit board, and method for manufacturing the same

Flexible prepreg and uses thereof

Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same

Solvent-free resin composition and uses of the same

Solvent-free resin composition and uses of the same

Resin composition and uses of the same

Resin composition and uses of the same

IND TECH RES INST

Hybrid capacitor

Mixing barbituric acid-modified BMI with MEK solution of epoxy resin and elastomer

Capacitor devices

Capacitor devices

Structure of an interleaving striped capacitor substrate

Composition of barbituric acid-modified BMI and PPE chain-broken in phenol resin

Photosensitive composition

Polyimide composition for LOC adhesive tapes

Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof

Nonaqueous electrolyte having maleimide additives and secondary cells employing the same

Semiconductor substrate assembly

LIU SHUR-FEN

Capacitor substrate structure

Flexible, low dielectric loss composition and method for preparing the same

TAIWAN UNION TECH CORP

Resin composition and uses of the same

Resin composition and uses of the same

LU CHARNG-SHING

Double-sided metal clad laminate and fabrication method thereof

Polyimide film laminate and metal laminate employing the same

JENG JHY-LONG

Thermally curable solder resist composition

Polyimide copolymers and method for fabricating patterned metal oxide layers

KO CHENG-TA

Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof

IND TECHNOLOGY RESERARCH INST

Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof

CHENG CHENG-LIANG

Decoupling device

WU SHIH-HSIEN

Capacitor structure

LEE MIN-LIN

Stepwise capacitor structure and substrate employing the same

LIU SHUR FEN

Resin composition and uses of the same

TAIWAN UNION TECH COMPANY

Resin composition and uses of the same

Chang li-ming

Polyamic acid resin composition and method for forming polyimide resin

CHANG YOU-CHIA

Transparent speaker and display module integrating the same