P

Inventor

KIM CHUL-SUNG

KR60 patents
⚠️ This page may combine multiple inventors who share the name “KIM CHUL-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

32 patents
US6383877B1May 7, 2002

Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer

SAMSUNG ELECTRONICS CO LTD49 citations96
US6849520B2Feb 1, 2005

Method and device for forming an STI type isolation in a semiconductor device

SAMSUNG ELECTRONICS CO LTD38 citations95
US9876094B2Jan 23, 2018

Method for fabricating semiconductor device having a silicide layer

SAMSUNG ELECTRONICS CO LTD20 citations94
US10079210B2Sep 18, 2018

Integrated circuit device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD32 citations93
US6890823B2May 10, 2005

Methods of forming integrated circuits with thermal oxide layers on side walls of gate electrodes wherein the source and drain are higher than the gate electrode

SAMSUNG ELECTRONICS CO LTD28 citations92
US6660613B2Dec 9, 2003

Method and device for forming an STI type isolation in a semiconductor device

SAMSUNG ELECTRONICS CO LTD18 citations92
US6624496B2Sep 23, 2003

Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer

SAMSUNG ELECTRONICS CO LTD29 citations92
US6329276B1Dec 11, 2001

Method of forming self-aligned silicide in semiconductor device

SAMSUNG ELECTRONICS CO LTD44 citations90
US10714579B2Jul 14, 2020

Semiconductor devices including recessed source/drain silicides and methods of forming the same

SAMSUNG ELECTRONICS CO LTD11 citations85
US9859387B2Jan 2, 2018

Semiconductor device having contact plugs

SAMSUNG ELECTRONICS CO LTD9 citations84
US7419918B2Sep 2, 2008

Methods of forming a thin-film structure, methods of manufacturing non-volatile semiconductor devices using the same, and resulting non-volatile semiconductor devices

SAMSUNG ELECTRONICS CO LTD13 citations84
US10283600B2May 7, 2019

Integrated circuit device

SAMSUNG ELECTRONICS CO LTD13 citations83
US7338867B2Mar 4, 2008

Semiconductor device having contact pads and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD5 citations74
US6218690B1Apr 17, 2001

Transistor having reverse self-aligned structure

SAMSUNG ELECTRONICS CO LTD11 citations74
US6835996B2Dec 28, 2004

Method and device for forming an STI type isolation in a semiconductor device

SAMSUNG ELECTRONICS CO LTD5 citations73
US10403717B2Sep 3, 2019

Semiconductor devices including contact structures that partially overlap silicide layers

SAMSUNG ELECTRONICS CO LTD2 citations72
US10332984B2Jun 25, 2019

Semiconductor devices having reduced contact resistance

SAMSUNG ELECTRONICS CO LTD3 citations72
US10269629B2Apr 23, 2019

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD4 citations71
US10262937B2Apr 16, 2019

Integrated circuit device

SAMSUNG ELECTRONICS CO LTD4 citations71
US10134856B2Nov 20, 2018

Semiconductor device including contact plug and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD3 citations71
US10128245B2Nov 13, 2018

Semiconductor devices including active areas with increased contact area

SAMSUNG ELECTRONICS CO LTD4 citations71
US8008214B2Aug 30, 2011

Method of forming an insulation structure and method of manufacturing a semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US7692196B2Apr 6, 2010

Memory devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US7579249B2Aug 25, 2009

Methods for fabricating DRAM semiconductor devices including silicon epitaxial and metal silicide layers

SAMSUNG ELECTRONICS CO LTD3 citations63
US7511340B2Mar 31, 2009

Semiconductor devices having gate structures and contact pads that are lower than the gate structures

SAMSUNG ELECTRONICS CO LTD2 citations63
US6963094B2Nov 8, 2005

Metal oxide semiconductor transistors having a drain punch through blocking region and methods for fabricating metal oxide semiconductor transistors having a drain punch through blocking region

SAMSUNG ELECTRONICS CO LTD4 citations63
US11063036B2Jul 13, 2021

Semiconductor device and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US10998412B2May 4, 2021

Semiconductor devices including recessed source/drain silicides and methods of forming the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US8008154B2Aug 30, 2011

Methods of forming impurity containing insulating films and flash memory devices including the same

SAMSUNG ELECTRONICS CO LTD3 citations62
US7893482B2Feb 22, 2011

Semiconductor devices having tunnel and gate insulating layers

SAMSUNG ELECTRONICS CO LTD3 citations62
US7608509B2Oct 27, 2009

Method of manufacturing a flash memory device having compensation members formed on edge portions of a tunnel oxide layer

SAMSUNG ELECTRONICS CO LTD6 citations62
US7585729B2Sep 8, 2009

Method of manufacturing a non-volatile memory device

SAMSUNG ELECTRONICS CO LTD6 citations62

EXXONMOBIL UPSTREAM RES CO

5 patents

SAMSUNG KWANGJU ELECTRONICS CO

3 patents

SHIN CHUNG HWAN

2 patents

EXXON PRODUCTION RESEARCH CO

1 patent

KIM JIN-BUM

1 patent

SHIN CHUNG-HWAN

1 patent

DOBIN MARK W

1 patent

HOLL JAMES E

1 patent

KIM CHUL-SUNG

1 patent

LEE DO-SUN

1 patent

UNIV KOREA RES & BUS FOUND

1 patent

Showing the top 50 of 60 patents by PatentIndex Score.