Inventor
KIM CHUL-SUNG
KR60 patents
⚠️ This page may combine multiple inventors who share the name “KIM CHUL-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
32 patentsUS6383877B1May 7, 2002
Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer
SAMSUNG ELECTRONICS CO LTD49 citations96
US6849520B2Feb 1, 2005
Method and device for forming an STI type isolation in a semiconductor device
SAMSUNG ELECTRONICS CO LTD38 citations95
US9876094B2Jan 23, 2018
Method for fabricating semiconductor device having a silicide layer
SAMSUNG ELECTRONICS CO LTD20 citations94
US10079210B2Sep 18, 2018
Integrated circuit device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD32 citations93
US6890823B2May 10, 2005
Methods of forming integrated circuits with thermal oxide layers on side walls of gate electrodes wherein the source and drain are higher than the gate electrode
SAMSUNG ELECTRONICS CO LTD28 citations92
US6660613B2Dec 9, 2003
Method and device for forming an STI type isolation in a semiconductor device
SAMSUNG ELECTRONICS CO LTD18 citations92
US6624496B2Sep 23, 2003
Method of forming T-shaped isolation layer, method of forming elevated salicide source/drain region using the same, and semiconductor device having T-shaped isolation layer
SAMSUNG ELECTRONICS CO LTD29 citations92
US6329276B1Dec 11, 2001
Method of forming self-aligned silicide in semiconductor device
SAMSUNG ELECTRONICS CO LTD44 citations90
US10714579B2Jul 14, 2020
Semiconductor devices including recessed source/drain silicides and methods of forming the same
SAMSUNG ELECTRONICS CO LTD11 citations85
US9859387B2Jan 2, 2018
Semiconductor device having contact plugs
SAMSUNG ELECTRONICS CO LTD9 citations84
US7419918B2Sep 2, 2008
Methods of forming a thin-film structure, methods of manufacturing non-volatile semiconductor devices using the same, and resulting non-volatile semiconductor devices
SAMSUNG ELECTRONICS CO LTD13 citations84
US10283600B2May 7, 2019
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD13 citations83
US7338867B2Mar 4, 2008
Semiconductor device having contact pads and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations74
US6218690B1Apr 17, 2001
Transistor having reverse self-aligned structure
SAMSUNG ELECTRONICS CO LTD11 citations74
US6835996B2Dec 28, 2004
Method and device for forming an STI type isolation in a semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations73
US10403717B2Sep 3, 2019
Semiconductor devices including contact structures that partially overlap silicide layers
SAMSUNG ELECTRONICS CO LTD2 citations72
US10332984B2Jun 25, 2019
Semiconductor devices having reduced contact resistance
SAMSUNG ELECTRONICS CO LTD3 citations72
US10269629B2Apr 23, 2019
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US10262937B2Apr 16, 2019
Integrated circuit device
SAMSUNG ELECTRONICS CO LTD4 citations71
US10134856B2Nov 20, 2018
Semiconductor device including contact plug and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US10128245B2Nov 13, 2018
Semiconductor devices including active areas with increased contact area
SAMSUNG ELECTRONICS CO LTD4 citations71
US8008214B2Aug 30, 2011
Method of forming an insulation structure and method of manufacturing a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD4 citations63
US7692196B2Apr 6, 2010
Memory devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations63
US7579249B2Aug 25, 2009
Methods for fabricating DRAM semiconductor devices including silicon epitaxial and metal silicide layers
SAMSUNG ELECTRONICS CO LTD3 citations63
US7511340B2Mar 31, 2009
Semiconductor devices having gate structures and contact pads that are lower than the gate structures
SAMSUNG ELECTRONICS CO LTD2 citations63
US6963094B2Nov 8, 2005
Metal oxide semiconductor transistors having a drain punch through blocking region and methods for fabricating metal oxide semiconductor transistors having a drain punch through blocking region
SAMSUNG ELECTRONICS CO LTD4 citations63
US11063036B2Jul 13, 2021
Semiconductor device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US10998412B2May 4, 2021
Semiconductor devices including recessed source/drain silicides and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US8008154B2Aug 30, 2011
Methods of forming impurity containing insulating films and flash memory devices including the same
SAMSUNG ELECTRONICS CO LTD3 citations62
US7893482B2Feb 22, 2011
Semiconductor devices having tunnel and gate insulating layers
SAMSUNG ELECTRONICS CO LTD3 citations62
US7608509B2Oct 27, 2009
Method of manufacturing a flash memory device having compensation members formed on edge portions of a tunnel oxide layer
SAMSUNG ELECTRONICS CO LTD6 citations62
US7585729B2Sep 8, 2009
Method of manufacturing a non-volatile memory device
SAMSUNG ELECTRONICS CO LTD6 citations62
EXXONMOBIL UPSTREAM RES CO
5 patentsUS6140643AOct 31, 2000
Method for identification of unknown substances
EXXONMOBIL UPSTREAM RES CO104 citations94
US6442487B2Aug 27, 2002
Reliability measures for statistical prediction of geophysical and geological parameters in geophysical prospecting
EXXONMOBIL UPSTREAM RES CO25 citations93
US7565243B2Jul 21, 2009
Rapid method for reservoir connectivity analysis using a fast marching method
EXXONMOBIL UPSTREAM RES CO31 citations90
US7330791B2Feb 12, 2008
Method for rapid fault interpretation of fault surfaces generated to fit three-dimensional seismic discontinuity data
EXXONMOBIL UPSTREAM RES CO33 citations88
US8365831B2Feb 5, 2013
Determining connectivity architecture in 2-D and 3-D heterogeneous data
EXXONMOBIL UPSTREAM RES CO7 citations83
SAMSUNG KWANGJU ELECTRONICS CO
3 patentsUS6149402ANov 21, 2000
Suction muffler for hermetic reciprocating compressor
SAMSUNG KWANGJU ELECTRONICS CO33 citations93
US6435841B1Aug 20, 2002
Hermetic reciprocating compressor
SAMSUNG KWANGJU ELECTRONICS CO17 citations84
US6450297B1Sep 17, 2002
Hermetic compressor
SAMSUNG KWANGJU ELECTRONICS CO8 citations74
SHIN CHUNG HWAN
2 patentsEXXON PRODUCTION RESEARCH CO
1 patentKIM JIN-BUM
1 patentSHIN CHUNG-HWAN
1 patentDOBIN MARK W
1 patentHOLL JAMES E
1 patentKIM CHUL-SUNG
1 patentLEE DO-SUN
1 patentUNIV KOREA RES & BUS FOUND
1 patentShowing the top 50 of 60 patents by PatentIndex Score.