Inventor
FARNWORTH WARREN
US24 patents
⚠️ This page may combine multiple inventors who share the name “FARNWORTH WARREN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
21 patentsUS6291894B1Sep 18, 2001
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC293 citations99
US5634267AJun 3, 1997
Method and apparatus for manufacturing known good semiconductor die
MICRON TECHNOLOGY INC228 citations99
US5607818AMar 4, 1997
Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition
MICRON TECHNOLOGY INC161 citations99
US6219908B1Apr 24, 2001
Method and apparatus for manufacturing known good semiconductor die
MICRON TECHNOLOGY INC106 citations98
US5796264AAug 18, 1998
Apparatus for manufacturing known good semiconductor dice
MICRON TECHNOLOGY INC107 citations98
US5578526ANov 26, 1996
Method for forming a multi chip module (MCM)
MICRON TECHNOLOGY INC114 citations98
US5559444ASep 24, 1996
Method and apparatus for testing unpackaged semiconductor dice
MICRON TECHNOLOGY INC186 citations98
US6673649B1Jan 6, 2004
Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
MICRON TECHNOLOGY INC92 citations97
US7300857B2Nov 27, 2007
Through-wafer interconnects for photoimager and memory wafers
MICRON TECHNOLOGY INC166 citations96
US6983536B2Jan 10, 2006
Method and apparatus for manufacturing known good semiconductor die
MICRON TECHNOLOGY INC23 citations92
US6763578B2Jul 20, 2004
Method and apparatus for manufacturing known good semiconductor die
MICRON TECHNOLOGY INC18 citations92
US6511863B2Jan 28, 2003
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC18 citations92
US6005290ADec 21, 1999
Multi chip module having self limiting contact members
MICRON TECHNOLOGY INC37 citations92
US5640762AJun 24, 1997
Method and apparatus for manufacturing known good semiconductor die
MICRON TECHNOLOGY INC40 citations92
US6903465B2Jun 7, 2005
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC11 citations74
US6777261B2Aug 17, 2004
Method and apparatus for a semiconductor package for vertical surface mounting
MICRON TECHNOLOGY INC8 citations74
US8963292B2Feb 24, 2015
Semiconductor device having backside redistribution layers and method for fabricating the same
MICRON TECHNOLOGY INC4 citations73
US7932179B2Apr 26, 2011
Method for fabricating semiconductor device having backside redistribution layers
MICRON TECHNOLOGY INC5 citations73
US7087995B2Aug 8, 2006
Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
MICRON TECHNOLOGY INC10 citations73
US7768040B2Aug 3, 2010
Imager device with electric connections to electrical device
MICRON TECHNOLOGY INC3 citations63
US7470563B2Dec 30, 2008
Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
MICRON TECHNOLOGY INC0 citations52