Inventor
EPPLER AARON
US18 patents
⚠️ This page may combine multiple inventors who share the name “EPPLER AARON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
16 patentsUS6391787B1May 21, 2002
Stepped upper electrode for plasma processing uniformity
LAM RES CORP153 citations99
US6824627B2Nov 30, 2004
Stepped upper electrode for plasma processing uniformity
LAM RES CORP104 citations98
US6921724B2Jul 26, 2005
Variable temperature processes for tunable electrostatic chuck
LAM RES CORP102 citations97
US7547635B2Jun 16, 2009
Process for etching dielectric films with improved resist and/or etch profile characteristics
LAM RES CORP21 citations92
US7405521B2Jul 29, 2008
Multiple frequency plasma processor method and apparatus
LAM RES CORP35 citations91
US10446394B2Oct 15, 2019
Spacer profile control using atomic layer deposition in a multiple patterning process
LAM RES CORP8 citations84
US7135410B2Nov 14, 2006
Etch with ramping
LAM RES CORP12 citations76
US9018103B2Apr 28, 2015
High aspect ratio etch with combination mask
LAM RES CORP5 citations73
US7645707B2Jan 12, 2010
Etch profile control
LAM RES CORP7 citations73
US7053003B2May 30, 2006
Photoresist conditioning with hydrogen ramping
LAM RES CORP9 citations66
US7682480B2Mar 23, 2010
Photoresist conditioning with hydrogen ramping
LAM RES CORP5 citations62
US10242883B2Mar 26, 2019
High aspect ratio etch of oxide metal oxide metal stack
LAM RES CORP0 citations52
US9659783B2May 23, 2017
High aspect ratio etch with combination mask
LAM RES CORP1 citations52
US7544521B1Jun 9, 2009
Negative bias critical dimension trim
LAM RES CORP0 citations50
US9899227B2Feb 20, 2018
System, method and apparatus for ion milling in a plasma etch chamber
LAM RES CORP0 citations39
US10763142B2Sep 1, 2020
System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameter
LAM RES CORP0 citations38