P

Inventor

WELING MILIND G

US16 patents
⚠️ This page may combine multiple inventors who share the name “WELING MILIND G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VLSI TECHNOLOGY INC

13 patents
US6214734B1Apr 10, 2001

Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection

VLSI TECHNOLOGY INC87 citations98
US5861342AJan 19, 1999

Optimized structures for dummy fill mask design

VLSI TECHNOLOGY INC75 citations96
US5639697AJun 17, 1997

Dummy underlayers for improvement in removal rate consistency during chemical mechanical polishing

VLSI TECHNOLOGY INC73 citations96
US5965941AOct 12, 1999

Use of dummy underlayers for improvement in removal rate consistency during chemical mechanical polishing

VLSI TECHNOLOGY INC21 citations92
US5618757AApr 8, 1997

Method for improving the manufacturability of the spin-on glass etchback process

VLSI TECHNOLOGY INC27 citations92
US5540958AJul 30, 1996

Method of making microscope probe tips

VLSI TECHNOLOGY INC42 citations92
US5653622AAug 5, 1997

Chemical mechanical polishing system and method for optimization and control of film removal uniformity

VLSI TECHNOLOGY INC38 citations86
US6057245AMay 2, 2000

Gas phase planarization process for semiconductor wafers

VLSI TECHNOLOGY INC14 citations82
US6034434AMar 7, 2000

Optimized underlayer structures for maintaining chemical mechanical polishing removal rates

VLSI TECHNOLOGY INC9 citations74
US5783488AJul 21, 1998

Optimized underlayer structures for maintaining chemical mechanical polishing removal rates

VLSI TECHNOLOGY INC14 citations74
US5496774AMar 5, 1996

Method improving integrated circuit planarization during etchback

VLSI TECHNOLOGY INC17 citations74
US6380092B1Apr 30, 2002

Gas phase planarization process for semiconductor wafers

VLSI TECHNOLOGY INC13 citations73
US6267076B1Jul 31, 2001

Gas phase planarization process for semiconductor wafers

VLSI TECHNOLOGY INC6 citations73

KONINKL PHILIPS ELECTRONICS NV

2 patents
US6916525B2Jul 12, 2005

Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection

KONINKL PHILIPS ELECTRONICS NV2 citations63
US6649253B1Nov 18, 2003

Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection

KONINKL PHILIPS ELECTRONICS NV2 citations63

PHILIPS ELECTRONICS NA

1 patent
US6255210B1Jul 3, 2001

Semiconductor dielectric structure and method for making the same

PHILIPS ELECTRONICS NA2 citations62