Inventor

PALMER MICHAEL J

US58 patents

⚠️ This page may combine multiple inventors who share the name “PALMER MICHAEL J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PALMER MICHAEL J

IBM

Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding

Apparatus and method for injection molding solder and applications thereof

Alignment device

Wirebond removal apparatus using alternating fluid stream

Electronic device elastomeric mounting and interconnection technology

Thermocompression bonding in integrated circuit packaging

Electronic substrate multiple location conductor attachment technology

Tape automated bonding feeder

Three dimensional microelectric packaging

Thermocompression bonding in integrated circuit packaging

High power, pluggable tape automated bonding package

Precision solder transfer method and means

Method of applying flex tape protective coating onto a flex product

Method and apparatus for fluxless solder bonding

Back-up and restoration of data between volatile and flash memory

Back-up and restoration of data between volatile and flash memory

Flex tape protective coating

Channel selection arbitration

Back-up and restoration of data between volatile and flash memory

Fast data back-up and restore between volatile and flash memory

Thermocompression bonding in integrated circuit packaging

Electronic substrate multiple location conductor attachment technology

Method for bonding dielectric mounted conductors to semiconductor chip contact pads

Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate

Bonding method employing organometallic interconnectors

Solder application system using helix to control solder meniscus

Method and apparatus for fluxless solder bonding

Castellated nozzle and method of use thereof

Serial data receiver with phase shift detection

High performance DMA transfers in host bus adapters

Back-up and restoration of data between volatile and flash memory

Thermocompression bonding in integrated circuit packaging

Lead frame plating apparatus for thermocompression bonding

Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate

Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent

VLSI chip macro interface

PFIZER

FKBP inhibitors

FKBP inhibitors

FKBP inhibitors

FKBP inhibitors

GE MED SYS INFORMATION TECH

Portable patient monitor with defibrillator/pacemaker interface and battery power management

Apparatus for monitoring gas concentrations

BICKFORD HARRY R

Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween

(unassigned)

Compressible structure clamping and cutting

SILICON SYSTEMS INC

One-shot circuit for use in a PLL clock recovery circuit

TEXAS INSTRUMENTS INC

Method and circuit for including parity bits in write data of a mass data storage device, or the like, using a 48/54 mtr (3:k) code constraint, and post-processing circuit and method for processing read back data that includes said code constraint

GEN ELECTRIC

Battery fuel gauge for display in battery-powered equipment

PALMER MICHAEL J

Gate valve with equalizer port

THUNDER ROSE ENTPR INC

Gate valve with equalizer port

NORDSON CORP

Flexible map with application data identifiers for PLC communications