Inventor

WENNEMUTH INGO

DE17 patents

⚠️ This page may combine multiple inventors who share the name “WENNEMUTH INGO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WENNEMUTH INGO

INFINEON TECHNOLOGIES AG

Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly

Electronic component with stacked electronic elements

Electronic component with multilayered rewiring plate and method for producing the same

Method for manufacturing a stack arrangement of a memory module

Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same

Electronic device having stacked modules and method for producing it

Self-supporting connecting element for a semiconductor chip

Method of fabricating an electronic component

Electronic component with stacked semiconductor chips and method of producing the component

Covering element for subassemblies

FBGA arrangement

Method for populating a substrate with electronic components

Semiconductor device with a rewiring level and method for producing the same

QIMONDA AG

Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly

Placement system for populating a substrate with electronic components

HETZEL WOLFGANG

Semiconductor component comprising an interposer substrate

GOSPODINOVA-DALTCHEVA MINKA

Integrated circuit and method for producing the same