Inventor
GOLDMANN LEWIS S
US32 patents
⚠️ This page may combine multiple inventors who share the name “GOLDMANN LEWIS S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
29 patentsUS6333563B1Dec 25, 2001
Electrical interconnection package and method thereof
IBM85 citations97
US5990418ANov 23, 1999
Hermetic CBGA/CCGA structure with thermal paste cooling
IBM156 citations97
US5982038ANov 9, 1999
Cast metal seal for semiconductor substrates
IBM71 citations96
US5968670AOct 19, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with spring
IBM63 citations96
US5881945AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates and process
IBM57 citations96
US5881944AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates
IBM53 citations96
US5821161AOct 13, 1998
Cast metal seal for semiconductor substrates and process thereof
IBM79 citations96
US6281452B1Aug 28, 2001
Multi-level thin-film electronic packaging structure and related method
IBM53 citations95
US6287126B1Sep 11, 2001
Mechanical attachment means used as electrical connection
IBM58 citations94
US7095614B2Aug 22, 2006
Electronic module assembly
IBM52 citations92
US6678949B2Jan 20, 2004
Process for forming a multi-level thin-film electronic packaging structure
IBM21 citations92
US6458623B1Oct 1, 2002
Conductive adhesive interconnection with insulating polymer carrier
IBM45 citations92
US6333104B1Dec 25, 2001
Conductive polymer interconnection configurations
IBM21 citations92
US6278184B1Aug 21, 2001
Solder disc connection
IBM35 citations92
US6253986B1Jul 3, 2001
Solder disc connection
IBM25 citations92
US6070321AJun 6, 2000
Solder disc connection
IBM20 citations92
US5975409ANov 2, 1999
Ceramic ball grid array using in-situ solder stretch
IBM36 citations92
US5964396AOct 12, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with clip
IBM36 citations92
US7518235B2Apr 14, 2009
Method and structure to provide balanced mechanical loading of devices in compressively loaded environments
IBM42 citations91
US6333209B1Dec 25, 2001
One step method for curing and joining BGA solder balls
IBM27 citations91
US7443026B2Oct 28, 2008
IC chip package having force-adjustable member between stiffener and printed circuit board
IBM12 citations84
US6724203B1Apr 20, 2004
Full wafer test configuration using memory metals
IBM13 citations84
US7566649B2Jul 28, 2009
Compressible films surrounding solder connectors
IBM8 citations83
US6258191B1Jul 10, 2001
Method and materials for increasing the strength of crystalline ceramic
IBM18 citations83
US6462271B2Oct 8, 2002
Capping structure for electronics package undergoing compressive socket actuation
IBM13 citations74
US6858111B2Feb 22, 2005
Conductive polymer interconnection configurations
IBM9 citations73
US7332821B2Feb 19, 2008
Compressible films surrounding solder connectors
IBM7 citations72
US6955543B2Oct 18, 2005
Method and apparatus to form a reworkable seal on an electronic module
IBM11 citations72
US5691467ANov 25, 1997
Method for mapping surfaces adapted for receiving electrical components
IBM5 citations62