Inventor

KURTH CASEY

US34 patents

⚠️ This page may combine multiple inventors who share the name “KURTH CASEY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KURTH CASEY

MICRON TECHNOLOGY INC

Embedded ROM device using substrate leakage

ROM embedded DRAM with bias sensing

Methods of forming electrical contacts

ROM embedded DRAM with programming

Back-to-back solid state lighting devices and associated methods

ROM redundancy in ROM embedded DRAM

ROM embedded DRAM with anti-fuse programming

ROM redundancy in ROM embedded DRAM

ROM embedded DRAM with anti-fuse programming

ROM embedded DRAM with dielectric removal/short

ROM embedded DRAM with bias sensing

6F2 architecture ROM embedded DRAM

ROM embedded DRAM with dielectric removal/short

ROM embedded DRAM with bias sensing

Half density ROM embedded DRAM

DRAM with bias sensing

Back-to-back solid state lighting devices and associated methods

Embedded ROM device using substrate leakage

Half density ROM embedded DRAM

ROM embedded DRAM with bias sensing

ROM embedded DRAM with bias sensing

Back-to-back solid state lighting devices and associated methods

Back-to-back solid state lighting devices and associated methods

Methods of forming an electrical contact to semiconductive material

Embedded ROM device using substrate leakage

Embedded ROM device using substrate leakage

ROM embedded DRAM with bias sensing

DRAM with bias sensing

BASCERI CEM

Back-to-back solid state lighting devices and associated methods

Solid state lighting dies with quantum emitters and associated methods of manufacturing

SCHUBERT MARTIN F

Engineered substrates for semiconductor devices and associated systems and methods

SCHELLHAMMER SCOTT D

Solid-state light emitters having substrates with thermal and electrical conductivity enhancements and method of manufacture

QROMIS INC

Engineered substrates for semiconductor devices and associated systems and methods

QUORA TECH INC

Solid-state light emitters having substrates with thermal and electrical conductivity enhancements and method of manufacture