Inventor
INOUE TATSUO
JP58 patents
⚠️ This page may combine multiple inventors who share the name “INOUE TATSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AISIN SEIKI
15 patentsUS5966944AOct 19, 1999
Superconducting magnet system outfitted with cooling apparatus
AISIN SEIKI85 citations96
US5845498ADec 8, 1998
Pulse tube refrigerator
AISIN SEIKI44 citations93
US5711156AJan 27, 1998
Multistage type pulse tube refrigerator
AISIN SEIKI47 citations93
US6389819B1May 21, 2002
Pulse tube refrigerator
AISIN SEIKI35 citations92
US6094921AAug 1, 2000
Pulse tube refrigerator
AISIN SEIKI34 citations92
US6434947B2Aug 20, 2002
Pulse tube refrigerator
AISIN SEIKI33 citations90
US6308520B1Oct 30, 2001
Multi-type pulse-tube refrigerating system
AISIN SEIKI23 citations89
US6460349B1Oct 8, 2002
Rotary valve unit in a pulse tube refrigerator
AISIN SEIKI36 citations88
US6351954B1Mar 5, 2002
Pulse tube refrigerator
AISIN SEIKI19 citations83
US5417066AMay 23, 1995
Stirling engine
AISIN SEIKI13 citations74
US6393845B1May 28, 2002
Pulse tube refrigerator
AISIN SEIKI8 citations73
US6279324B1Aug 28, 2001
Heat-regenerating type cryogenic cooling apparatus
AISIN SEIKI11 citations73
US6196006B1Mar 6, 2001
Pulse tube refrigerator
AISIN SEIKI9 citations73
US7207191B2Apr 24, 2007
Cryogenic refrigerator
AISIN SEIKI5 citations62
US6301902B1Oct 16, 2001
Pulse tube refrigerator
AISIN SEIKI6 citations62
NEC CORP
10 patentsUS4685033AAug 4, 1987
Multilayer wiring substrate
NEC CORP173 citations99
US4816323AMar 28, 1989
Multilayer wiring substrate
NEC CORP57 citations96
US5861664AJan 19, 1999
LSI package and manufacturing method thereof
NEC CORP18 citations93
US4754371AJun 28, 1988
Large scale integrated circuit package
NEC CORP39 citations91
US5892657AApr 6, 1999
Electronic-circuit assembly and its manufacturing method
NEC CORP19 citations84
US5909010AJun 1, 1999
Chip size package
NEC CORP11 citations74
US4731699AMar 15, 1988
Mounting structure for a chip
NEC CORP11 citations74
US4594473AJun 10, 1986
Substrate having at least one fine-wired conductive layer
NEC CORP15 citations73
US6153447ANov 28, 2000
LSI package and manufacturing method thereof
NEC CORP3 citations63
US5993946ANov 30, 1999
Wiring board for mounting electronic devices with high-density terminals and method for producing wiring board
NEC CORP3 citations63
SONY CORP
6 patentsUS6188495B1Feb 13, 2001
Optical transmission-reception apparatus
SONY CORP87 citations97
US5731917AMar 24, 1998
Projection tv set apparatus
SONY CORP26 citations93
US5617259AApr 1, 1997
Projection TV set apparatus
SONY CORP18 citations93
US5083209AJan 21, 1992
Video camera
SONY CORP23 citations92
US4623931ANov 18, 1986
Portable video camera with image pick-up device
SONY CORP27 citations88
US6246499B1Jun 12, 2001
Optical signal communication apparatus and optical signal communication method
SONY CORP19 citations83
NIHON MICRONICS KK
4 patentsUS9400309B2Jul 26, 2016
Electric connecting apparatus
NIHON MICRONICS KK4 citations73
US7735221B2Jun 15, 2010
Method for manufacturing a multilayer wiring board
NIHON MICRONICS KK4 citations60
US10347893B2Jul 9, 2019
Secondary battery
NIHON MICRONICS KK1 citations59
US9535090B2Jan 3, 2017
Electric connecting apparatus
NIHON MICRONICS KK1 citations51
EBARA CORP
3 patentsTOKYO AUTOMATIC MACH WORKS
3 patentsUS6378277B1Apr 30, 2002
Vertical sealing device for vertical type forming, filling and closing machine for flexible packages
TOKYO AUTOMATIC MACH WORKS18 citations81
US6155030ADec 5, 2000
Sealing apparatus applied to a vertical type forming, filling and closing machine for flexible package
TOKYO AUTOMATIC MACH WORKS14 citations69
US6502366B1Jan 7, 2003
Packing material feeding apparatus for vertical-type bag form-fill-sealing machine
TOKYO AUTOMATIC MACH WORKS6 citations59
AISIN NEW HARD KK
2 patentsMOLEX CORP
1 patentTOSHIBA KK
1 patentFURUKAWA CO LTD
1 patent(unassigned)
1 patentMAEDA HIROKI
1 patentFUJI ELECTRIC CO LTD
1 patentSUMITOMO WIRING SYSTEMS
1 patentShowing the top 50 of 58 patents by PatentIndex Score.