Inventor
PIRKLE DAVID R
US10 patents
Patents
10 patentsUS5915190AJun 22, 1999
Methods for filling trenches in a semiconductor wafer
LAM RES CORP324 citations98
US5846373ADec 8, 1998
Method for monitoring process endpoints in a plasma chamber and a process monitoring arrangement in a plasma chamber
LAM RES CORP221 citations97
US5647953AJul 15, 1997
Plasma cleaning method for removing residues in a plasma process chamber
LAM RES CORP189 citations95
US6670278B2Dec 30, 2003
Method of plasma etching of silicon carbide
LAM RES CORP54 citations94
US6016766AJan 25, 2000
Microwave plasma processor
LAM RES CORP54 citations94
US6909195B2Jun 21, 2005
Trench etch process for low-k dielectrics
LAM RES CORP16 citations91
US6962879B2Nov 8, 2005
Method of plasma etching silicon nitride
LAM RES CORP43 citations89
US6794293B2Sep 21, 2004
Trench etch process for low-k dielectrics
LAM RES CORP14 citations82
US5841623ANov 24, 1998
Chuck for substrate processing and method for depositing a film in a radio frequency biased plasma chemical depositing system
LAM RES CORP13 citations71
US7534363B2May 19, 2009
Method for providing uniform removal of organic material
LAM RES CORP3 citations60