P

Inventor

LEE JAMES YONG MENG

SG30 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAMES YONG MENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHARTERED SEMICONDUCTOR MFG

26 patents
US6300177B1Oct 9, 2001

Method to form transistors with multiple threshold voltages (VT) using a combination of different work function gate materials

CHARTERED SEMICONDUCTOR MFG175 citations99
US6313008B1Nov 6, 2001

Method to form a balloon shaped STI using a micro machining technique to remove heavily doped silicon

CHARTERED SEMICONDUCTOR MFG90 citations98
US6747314B2Jun 8, 2004

Method to form a self-aligned CMOS inverter using vertical device integration

CHARTERED SEMICONDUCTOR MFG93 citations97
US6406945B1Jun 18, 2002

Method for forming a transistor gate dielectric with high-K and low-K regions

CHARTERED SEMICONDUCTOR MFG59 citations96
US6403485B1Jun 11, 2002

Method to form a low parasitic capacitance pseudo-SOI CMOS device

CHARTERED SEMICONDUCTOR MFG66 citations96
US6709934B2Mar 23, 2004

Method for forming variable-K gate dielectric

CHARTERED SEMICONDUCTOR MFG26 citations93
US6511884B1Jan 28, 2003

Method to form and/or isolate vertical transistors

CHARTERED SEMICONDUCTOR MFG48 citations93
US6468877B1Oct 22, 2002

Method to form an air-gap under the edges of a gate electrode by using disposable spacer/liner

CHARTERED SEMICONDUCTOR MFG53 citations93
US6455377B1Sep 24, 2002

Method to form very high mobility vertical channel transistor by selective deposition of SiGe or multi-quantum wells (MQWs)

CHARTERED SEMICONDUCTOR MFG21 citations93
US6436770B1Aug 20, 2002

Method to control the channel length of a vertical transistor by first forming channel using selective epi and source/drain using implantation

CHARTERED SEMICONDUCTOR MFG45 citations93
US6417056B1Jul 9, 2002

Method to form low-overlap-capacitance transistors by forming microtrench at the gate edge

CHARTERED SEMICONDUCTOR MFG51 citations93
US6306715B1Oct 23, 2001

Method to form smaller channel with CMOS device by isotropic etching of the gate materials

CHARTERED SEMICONDUCTOR MFG46 citations93
US6197691B1Mar 6, 2001

Shallow trench isolation process

CHARTERED SEMICONDUCTOR MFG31 citations92
US6475916B1Nov 5, 2002

Method of patterning gate electrode with ultra-thin gate dielectric

CHARTERED SEMICONDUCTOR MFG37 citations90
US6391720B1May 21, 2002

Process flow for a performance enhanced MOSFET with self-aligned, recessed channel

CHARTERED SEMICONDUCTOR MFG38 citations87
US6461887B1Oct 8, 2002

Method to form an inverted staircase STI structure by etch-deposition-etch and selective epitaxial growth

CHARTERED SEMICONDUCTOR MFG18 citations84
US6380088B1Apr 30, 2002

Method to form a recessed source drain on a trench side wall with a replacement gate technique

CHARTERED SEMICONDUCTOR MFG19 citations84
US6306741B1Oct 23, 2001

Method of patterning gate electrodes with high K gate dielectrics

CHARTERED SEMICONDUCTOR MFG18 citations82
US6541327B1Apr 1, 2003

Method to form self-aligned source/drain CMOS device on insulated staircase oxide

CHARTERED SEMICONDUCTOR MFG8 citations74
US6436774B1Aug 20, 2002

Method for forming variable-K gate dielectric

CHARTERED SEMICONDUCTOR MFG8 citations74
US6303449B1Oct 16, 2001

Method to form self-aligned elevated source/drain by selective removal of gate dielectric in the source/drain region followed by poly deposition and CMP

CHARTERED SEMICONDUCTOR MFG12 citations74
US6440800B1Aug 27, 2002

Method to form a vertical transistor by selective epitaxial growth and delta doped silicon layers

CHARTERED SEMICONDUCTOR MFG5 citations63
US6417054B1Jul 9, 2002

Method for fabricating a self aligned S/D CMOS device on insulated layer by forming a trench along the STI and fill with oxide

CHARTERED SEMICONDUCTOR MFG5 citations63
US6458717B1Oct 1, 2002

Methods of forming ultra-thin buffer oxide layers for gate dielectrics

CHARTERED SEMICONDUCTOR MFG5 citations62
US7037791B2May 2, 2006

Application of single exposure alternating aperture phase shift mask to form sub 0.18 micron polysilicon gates

CHARTERED SEMICONDUCTOR MFG4 citations60
US7767577B2Aug 3, 2010

Nested and isolated transistors with reduced impedance difference

CHARTERED SEMICONDUCTOR MFG0 citations51

UNIV SINGAPORE

1 patent

MISHRA SHAILENDRA

1 patent

GLOBALFOUNDRIES SG PTE LTD

1 patent

WIDODO JOHNNY

1 patent